Silicon on insulator

Results: 65



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1Letter  Vol. 1, No. 4 / OctoberOptica 198

Letter Vol. 1, No. 4 / OctoberOptica 198

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Source URL: www.imt.kit.edu

Language: English - Date: 2015-10-06 08:44:02
2Electronic Devices on Various Substrates: Fabrication of Releasable SingleCrystal SiliconMetal Oxide FieldEffect Devices and Their Deterministic Assembly on Foreign Substrates (Adv. Funct. Mater)

Electronic Devices on Various Substrates: Fabrication of Releasable SingleCrystal SiliconMetal Oxide FieldEffect Devices and Their Deterministic Assembly on Foreign Substrates (Adv. Funct. Mater)

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Source URL: rogers.matse.illinois.edu

Language: English - Date: 2011-08-11 13:58:07
3Evaluation of Silicon on Insulator (SOI) Bonded Wafers Using Automated Acoustic Micro Imaging Janet E. Semmens and Bryan P. Schackmuth Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA

Evaluation of Silicon on Insulator (SOI) Bonded Wafers Using Automated Acoustic Micro Imaging Janet E. Semmens and Bryan P. Schackmuth Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA

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Source URL: www.sonoscan.com

Language: English - Date: 2016-07-20 11:09:32
4Inside Front Cover: Defect Tolerance and Nanomechanics in Transistors that Use Semiconductor Nanomaterials and Ultrathin Dielectrics (Adv. Funct. Mater)

Inside Front Cover: Defect Tolerance and Nanomechanics in Transistors that Use Semiconductor Nanomaterials and Ultrathin Dielectrics (Adv. Funct. Mater)

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Source URL: rogers.matse.illinois.edu

Language: English - Date: 2008-09-08 15:02:12
5FULL PAPER  DOI: adfmTheoretical and Experimental Studies of Bending of Inorganic Electronic Materials on Plastic Substrates**

FULL PAPER DOI: adfmTheoretical and Experimental Studies of Bending of Inorganic Electronic Materials on Plastic Substrates**

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Source URL: rogers.matse.illinois.edu

Language: English - Date: 2008-09-20 08:28:30
6Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication

Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication

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Source URL: www.sonoscan.com

Language: English - Date: 2016-07-20 11:09:32
7F r a u n h o f e r I n s t i t u t e f o r Mic r o e l e c t r o n ic C i r c u i t s a n d S y s t e m s  Programme Inter Carnot Fraunhofer HOTMOS High temperature SOI CMOS technology platform for applications up to 25

F r a u n h o f e r I n s t i t u t e f o r Mic r o e l e c t r o n ic C i r c u i t s a n d S y s t e m s Programme Inter Carnot Fraunhofer HOTMOS High temperature SOI CMOS technology platform for applications up to 25

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Source URL: www.ims.fraunhofer.de

Language: English - Date: 2016-08-18 14:30:09
8Flexible Electronics  Thin, Flexible Sensors and Actuators as ‘Instrumented’ Surgical Sutures for Targeted Wound Monitoring and Therapy Dae-Hyeong Kim, Shuodao Wang, Hohyun Keum, Roozbeh Ghaffari,

Flexible Electronics Thin, Flexible Sensors and Actuators as ‘Instrumented’ Surgical Sutures for Targeted Wound Monitoring and Therapy Dae-Hyeong Kim, Shuodao Wang, Hohyun Keum, Roozbeh Ghaffari,

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Source URL: rogers.matse.illinois.edu

Language: English - Date: 2012-11-19 13:01:24
994 Technology focus: GaN-on-silicon  Metal-insulator-semiconductor gated hybrid anode GaN-on-silicon diode A reverse breakdown voltage of more than 1.1kV has been achieved with

94 Technology focus: GaN-on-silicon Metal-insulator-semiconductor gated hybrid anode GaN-on-silicon diode A reverse breakdown voltage of more than 1.1kV has been achieved with

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Source URL: www.semiconductor-today.com

Language: English - Date: 2015-09-01 10:45:19
    10Leti_NR_UTSOI2_FINAL_11 03 15

    Leti_NR_UTSOI2_FINAL_11 03 15

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    Source URL: www-leti.cea.fr

    Language: English - Date: 2015-04-09 08:55:05