Acoustic microscopy

Results: 42



#Item
1Development of a Resolution Test Wafer for Use in Acoustic Microscopy of Microelectronic Devices Janet E. Semmens1, Rupert Fischer2, and Lawrence W. Kessler1 1 Sonoscan, IncE. Pratt Blvd.

Development of a Resolution Test Wafer for Use in Acoustic Microscopy of Microelectronic Devices Janet E. Semmens1, Rupert Fischer2, and Lawrence W. Kessler1 1 Sonoscan, IncE. Pratt Blvd.

Add to Reading List

Source URL: www.sonoscan.com

- Date: 2016-07-20 11:09:32
    2High-Frequency Acoustic Microscopy Studies of Buried Interfaces in Silicon

    High-Frequency Acoustic Microscopy Studies of Buried Interfaces in Silicon

    Add to Reading List

    Source URL: www.sonoscan.com

    - Date: 2016-07-20 11:09:32
      3Technology Opportunity, Ref. No. UAA novel algorithm for phase computation in atomic force microscopy A novel algorithm has been developed which provides highly accurate phase measurements. In particular, the al

      Technology Opportunity, Ref. No. UAA novel algorithm for phase computation in atomic force microscopy A novel algorithm has been developed which provides highly accurate phase measurements. In particular, the al

      Add to Reading List

      Source URL: www.switt.ch

      Language: English - Date: 2015-10-13 03:40:46
      4CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A.

      CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A.

      Add to Reading List

      Source URL: www.sonoscan.com

      Language: English - Date: 2016-07-20 11:09:32
      5US008720273B2United States Patent Kessler et a1. (54)

      US008720273B2United States Patent Kessler et a1. (54)

      Add to Reading List

      Source URL: www.sonoscan.com

      Language: English - Date: 2016-07-11 10:56:20
      6Evaluation of Silicon on Insulator (SOI) Bonded Wafers Using Automated Acoustic Micro Imaging Janet E. Semmens and Bryan P. Schackmuth Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA

      Evaluation of Silicon on Insulator (SOI) Bonded Wafers Using Automated Acoustic Micro Imaging Janet E. Semmens and Bryan P. Schackmuth Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA

      Add to Reading List

      Source URL: www.sonoscan.com

      Language: English - Date: 2016-07-20 11:09:32
      7P  PAUMANOK PUBLICATIONS  JANUARY/FEBRUARY 2007

      P PAUMANOK PUBLICATIONS JANUARY/FEBRUARY 2007

      Add to Reading List

      Source URL: www.sonoscan.com

      Language: English - Date: 2016-07-20 11:09:32
      8J610™ Product Specification  J610 ™

      J610™ Product Specification J610 ™

      Add to Reading List

      Source URL: www.sonoscan.com

      Language: English - Date: 2016-07-11 10:56:20
      9EVALUATION OF UNDERFILL IN FLIP CHIP AND BGA ON PC BOARDS USING 3V RECONSTRUCTION AND THROUGHTRANSMISSION IMAGING Janet E. Semmens Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA

      EVALUATION OF UNDERFILL IN FLIP CHIP AND BGA ON PC BOARDS USING 3V RECONSTRUCTION AND THROUGHTRANSMISSION IMAGING Janet E. Semmens Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA

      Add to Reading List

      Source URL: www.sonoscan.com

      Language: English - Date: 2016-07-20 11:09:32
      10Microsoft Word - Sonoscan - Copyrighted - SMTA ChinaAutomating C-SAM Process Control - From Lab to Fab and Back-End.doc

      Microsoft Word - Sonoscan - Copyrighted - SMTA ChinaAutomating C-SAM Process Control - From Lab to Fab and Back-End.doc

      Add to Reading List

      Source URL: www.sonoscan.com

      Language: English - Date: 2016-07-20 11:09:32