Capacitive micromachined ultrasonic transducers

Results: 8



#Item
1Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication

Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication

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Source URL: www.sonoscan.com

Language: English - Date: 2016-07-20 11:09:32
2rdv_carnotcapteur MEMS only

rdv_carnotcapteur MEMS only

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Source URL: www-leti.cea.fr

Language: English - Date: 2010-09-22 09:53:58
3Volume 22, Issue 3  Summer 2012 Vibrations Ultrasonic Industry Association

Volume 22, Issue 3 Summer 2012 Vibrations Ultrasonic Industry Association

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Source URL: www.ultrasonics.org

Language: English - Date: 2012-08-11 12:40:48
4Micromachined 35 MHz PC-MUT Array X. Jiang1, R. Liu2, X. Geng2, K. Snook1 and W. Hackenberger1,1 TRS Technologies, Inc., 2 Blatek, Inc., State College, PA. High frequency ultrasound phased array is desired for precise an

Micromachined 35 MHz PC-MUT Array X. Jiang1, R. Liu2, X. Geng2, K. Snook1 and W. Hackenberger1,1 TRS Technologies, Inc., 2 Blatek, Inc., State College, PA. High frequency ultrasound phased array is desired for precise an

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Source URL: www.mri.psu.edu

Language: English - Date: 2010-08-25 15:49:29
5

PDF Document

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Source URL: www.tufts.edu

Language: English - Date: 2008-03-14 18:41:33
6

PDF Document

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Source URL: www-kyg.stanford.edu

Language: English - Date: 2007-04-01 21:56:55
7

PDF Document

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Source URL: www.ieee-uffc.org

Language: English - Date: 2008-12-29 17:55:23
8

PDF Document

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Source URL: www.ieee-uffc.org

Language: English - Date: 2008-12-29 17:55:19