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Three-dimensional integrated circuit
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1	Programming for Future 3D Architectures with Manycore Introduction The shift from Systems-on-Chip (SoC) to manycore architectures brings new hardware and software challenges ranging from seamless integration of processo Add to Reading List Source URL: www.pro3d.eu Language: English - Date: 2011-06-27 05:55:03 Computing Engineering Parallel computing Computer engineering Computer architecture Manycore processors Microprocessors Emerging technologies Multi-core processor Computer-aided design Three-dimensional integrated circuit 3D modeling
2	Evaluation of Silicon on Insulator (SOI) Bonded Wafers Using Automated Acoustic Micro Imaging Janet E. Semmens and Bryan P. Schackmuth Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Semiconductor device fabrication Materials science Technology Electronic engineering Wafer Silicon on insulator Acoustic microscopy Integrated circuit Three-dimensional integrated circuit Soitec Smart cut
3	DEAR FELLOW STOCKHOLDERS 2015 was a very exciting year for the Rudolph team, our customers, and stockholders. We delivered the highest level of revenue in the history of our company, driven by strong execution on our st Add to Reading List Source URL: www.tamartechnology.com Language: English - Date: 2016-04-21 10:07:07 Semiconductor device fabrication Technology Rudolph Technologies Inc. Microtechnology Electronic engineering Wafer Stepper Photolithography Three-dimensional integrated circuit Integrated circuit KLA-Tencor SUSS MicroTec
4	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden YEARS Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2016-05-25 07:28:49 Semiconductor device fabrication Integrated circuits Electronic engineering Electronics Electromagnetism Packaging Three-dimensional integrated circuit Through-silicon via Fraunhofer Society Wafer backgrinding Wafer
5	TSV BIST™: An Innovative Method for 2.5D/3D IC Interconnection Integrity Monitoring Hans Manhaeve, Ph.D. Ridgetop Europe, n.v. L. Bauwensstraat 20, B-8200 Brugge, Belgium Add to Reading List Source URL: www.ridgetopgroup.com Language: English - Date: 2015-07-18 01:30:08 Electronic engineering Electromagnetism Integrated circuits Electronics Semiconductor devices Semiconductor device fabrication Electronics manufacturing Survival analysis Three-dimensional integrated circuit Through-silicon via Embedded instrumentation Built-in self-test
6	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2016-08-19 15:01:56 Semiconductor device fabrication Integrated circuits Packaging Microtechnology Electronics manufacturing Three-dimensional integrated circuit Through-silicon via Microelectromechanical systems Wafer-level packaging Wafer Chip-scale package System in package
7	Copy of Session Schedule Combined Master.xlsx Add to Reading List Source URL: www.iwlpc.com Language: English - Date: 2016-08-15 13:37:41 Semiconductor device fabrication Integrated circuits Packaging Microtechnology Wafer-level packaging Three-dimensional integrated circuit Embedded Wafer Level Ball Grid Array SUSS MicroTec System in package Chip-scale package Through-silicon via Microelectromechanical systems
8	UNITED STATES SECURITIES AND EXCHANGE COMMISSION WASHINGTON, D.C_____________________________ FORM 10-K Add to Reading List Source URL: www.tamartechnology.com Language: English - Date: 2015-04-28 13:04:29 Semiconductor device fabrication Rudolph Technologies Inc. Wafer Photolithography Stepper Three-dimensional integrated circuit Automated X-ray inspection Ellipsometry Integrated circuit KLA-Tencor
9	Stretchable Electronics: Stretchable InorganicSemiconductor Electronic Systems (Adv. Mater) Add to Reading List Source URL: rogers.matse.illinois.edu Language: English - Date: 2011-07-08 11:04:37 Electronic engineering Electronics manufacturing Light-emitting diode Signage Integrated circuits Printed circuit board Semiconductor device fabrication Three-dimensional integrated circuit Dynamic random-access memory Gallium nitride Silicon carbide
10	Abstract Minapad 2012_version finale Add to Reading List Source URL: www.leti.fr Language: English - Date: 2012-03-14 11:06:08 Through-silicon via Semiconductor device fabrication Integrated circuits Three-dimensional integrated circuit