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Semiconductor packages
Results: 22

#	Item
1	Investigation of Driver Circuits for GaN HEMTs in Leaded Packages Zhan Wang, Jim Honea Yuxiang Shi, Hui Li Add to Reading List Source URL: www.transphormusa.com Language: English - Date: 2016-08-11 14:28:58 Power electronics Semiconductor devices Energy storage Electric power conversion High-electron-mobility transistor Transistor Field-effect transistor Inductor Cascode H bridge Gate driver Ferrite bead
2	Production Test Chip-scale packages: Inspection methods for diverse designs Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Packaging Electronics manufacturing Semiconductor device fabrication Solder ball Rework Flip chip Solder Chip-scale package Reliability Automated X-ray inspection Integrated circuit packaging Flux
3	FRAUNHOFER-INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM THERMAL TRANSIENT TESTING OF SEMICONDUCTOR POWER PACKAGES System: MentorGraphics T3Ster® Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-05 16:32:21
4	2N3906 / MMBT3906 / PZT3906 PNP General-Purpose Amplifier Description This device is designed for general-purpose amplifier and switching applications at collector currents of 10 mA to 100 mA. Add to Reading List Source URL: www.fairchildsemi.com Language: English - Date: 2015-05-03 16:04:40 Semiconductor packages 2N3906 Transistor Integrated circuits Bipolar junction transistor TO-92 Common base Biasing IC power supply pin Electronics Electrical engineering Electronic engineering
5	LM341/LM78MXX Series 3-Terminal Positive Voltage Regulators General Description Features Add to Reading List Source URL: optimus.meleeisland.net Language: English Analog circuits Semiconductor packages Voltage regulator Load regulation TO-3 Line regulation Biasing TO-220 Transistor Electronics Electronic engineering Electromagnetism
6	Efficiency and Cost Tradeoffs Between Aluminum and ZincAluminum Die Cast Heatsinks Kurtis P. Keller University of North Carolina, Computer Science Department Chapel Hill, NC[removed], USA Add to Reading List Source URL: www.cs.unc.edu Language: English - Date: 1998-06-11 16:11:38 Passive fire protection Heat transfer Heat conduction Semiconductor packages TO-220 Thermal management of electronic devices and systems Heat sink Thermal resistance Thermal conductivity Mechanical engineering Chemistry Chemical engineering
7	Global Semiconductor Alliance Electrostatic Discharge (ESD) in 3D-IC Packages Version 1.0 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2015-01-23 15:21:51 Electrical breakdown Electrical safety Semiconductor device fabrication Electrostatics Electrostatic discharge Human-body model Three-dimensional integrated circuit Transmission-line pulse Through-silicon via Electromagnetism Integrated circuits Physics
8	Semiconductors and Solutions for Energy-saving/Low-power Systems SDIP-Packaged High-Speed Coupler Series TORIKAI Masahiro, ASAI Michinari, KANATAKE Mitsuhito Abstract Backed by the rise in environmental concern and dema Add to Reading List Source URL: www.nec.com Language: English - Date: 2012-09-11 09:28:23 Dual in-line package Semiconductor packages Electronic engineering Industrial engineering Insulator Light-emitting diode Packaging and labeling Technology Electromagnetism Semiconductor devices
9	Flexible Packaging Achievement Awards 2012 Winning packages are organized in alphabetical order by award level (Highest Achievement, Gold, Silver). The information and descriptions for all packages are provided by the ma Add to Reading List Source URL: www.flexpack.org Language: English - Date: 2012-02-23 12:57:13 Semiconductor device fabrication Industrial design Packaging and labeling Retailing Bemis Company Amcor Integrated circuit packaging Dual in-line package Graphic design Technology Business Industrial engineering
10	3D Systems Packaging Research Center Glass and Silicon Packages AN INDUSTRY-ACADEMIA CONSORTIUM Add to Reading List Source URL: www.prc.gatech.edu Language: English - Date: 2013-04-29 07:49:13 Microtechnology Three-dimensional integrated circuit Silicon Polycrystalline silicon Wafer Chemistry Semiconductor device fabrication Matter

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