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Integrated circuit packaging
Results: 80

#	Item
1	F R A U N H O F E R re s ear c h I n s t i t u t ion for M i c ro s y s t em s an d So l i d S tat e Te c hno l o g ie s E M F T 2 1 Add to Reading List Source URL: www.emft.fraunhofer.de Language: English - Date: 2015-11-12 01:37:49 Semiconductor device fabrication Electronic engineering Technology Electromagnetism Wafer backgrinding Wafer Integrated circuit packaging Roll-to-roll processing Integrated circuit Wafer dicing
2	CSP and micro-BGA Process and Damage Assessment with Acoustic Micro Imaging (AMI) Steven R. Martell and J.E. Semmens SONOSCAN IncE. Pratt Blvd. Elk Grove Village, IL 60007 Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Electronic engineering Electrical engineering Electromagnetism Semiconductor device fabrication Packaging Electronics manufacturing Ball grid array Surface-mount technology Solder Reflow soldering Integrated circuit packaging Reliability
3	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden YEARS Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2016-05-25 07:28:49 Semiconductor device fabrication Integrated circuits Electronic engineering Electronics Electromagnetism Packaging Three-dimensional integrated circuit Through-silicon via Fraunhofer Society Wafer backgrinding Wafer
4	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2016-08-19 15:01:56 Semiconductor device fabrication Integrated circuits Packaging Microtechnology Electronics manufacturing Three-dimensional integrated circuit Through-silicon via Microelectromechanical systems Wafer-level packaging Wafer Chip-scale package System in package
5	RGSJBIST PRODUCT BRIEF E N G I N E E R I N G I N N O V A T I O N Add to Reading List Source URL: www.ridgetopgroup.com Language: English - Date: 2015-11-06 10:47:45 Electronics manufacturing Semiconductor device fabrication Packaging Integrated circuits Survival analysis Printed circuit board Solder Through-silicon via Wire bonding Prognostics Built-in self-test Reliability engineering
6	Copy of Session Schedule Combined Master.xlsx Add to Reading List Source URL: www.iwlpc.com Language: English - Date: 2016-08-15 13:37:41 Semiconductor device fabrication Integrated circuits Packaging Microtechnology Wafer-level packaging Three-dimensional integrated circuit Embedded Wafer Level Ball Grid Array SUSS MicroTec System in package Chip-scale package Through-silicon via Microelectromechanical systems
7	PREMIUM PACKAGE Small Footprint, BIG POWER. RS420c Add to Reading List Source URL: inauengroup.com Language: English - Date: 2013-08-29 16:50:58 Packaging Software distribution Packaging and labeling Retailing Integrated circuit packaging Package manager
8	「維基夥伴獎學金」獎助生成果報告書簡報檔 Backside Via Hole and Flip-Chip Packaging of GaAs MMICs for W-Band Applications Adviser：Prof. Edward Yi Chang Add to Reading List Source URL: diamondprj.nctu.edu.tw Language: English - Date: 2015-08-26 02:29:40 Semiconductor device fabrication Semiconductor devices Integrated circuits Monolithic microwave integrated circuit Packaging Reliability Integrated circuit packaging Integrated circuit Flip chip Gallium arsenide Transistor
9	Production Test Chip-scale packages: Inspection methods for diverse designs Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Packaging Electronics manufacturing Semiconductor device fabrication Solder ball Rework Flip chip Solder Chip-scale package Reliability Automated X-ray inspection Integrated circuit packaging Flux
10	Wireless Bridge to Sensors using RFID Microchips for every industry – ‘Make more with less’ Who is Gert Jørgensen ? Add to Reading List Source URL: assets.madebydelta.com Language: English - Date: 2014-09-29 06:59:30 Privacy Radio-frequency identification Ubiquitous computing Wireless Application-specific integrated circuit Packaging and labeling Technology Electronic engineering Automatic identification and data capture

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