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Flip chip
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1	NVM-Series Surface Profiling System NVM-Series is automated high speed measurement tool for in-line process monitor for high density, micro-via substrates used in flip-chip package. Automated align $ auto focus functions Add to Reading List Source URL: nanosystemz.com Language: English
2	Application Note \| AN105 Flip-Chip Interconnection Integrity Testing Solutions Introduction This application note describes interconnection reliability problems, provides the flip-chip solution overview, and includes tes Add to Reading List Source URL: www.ridgetopgroup.com - Date: 2015-08-21 20:05:36
3	Characterization of Flip Chip Interconnect Failure Modes Using High Frequency Acoustic Micro Imaging With Correlative Analysis Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Add to Reading List Source URL: www.sonoscan.com - Date: 2016-07-20 11:09:32
4	CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A. Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Microscopy Electronics manufacturing Manufacturing Economy Business Acoustic microscopy Flip chip Solder Reliability Integrated circuit Bump Microscope
5	Microsoft Word - MXP7205VF Rev.E.doc Add to Reading List Source URL: www.memsic.com Language: English - Date: 2013-02-11 20:35:20 Computer buses Engineering Computing Technology Serial Peripheral Interface Bus Analog-to-digital converter Accelerometer Chip select Sensor Flip-flop
6	6 Position Flip Chip - Ford Pacific Performance Engineering, Inc. www.ppediesel.com 6 Position Flip Chip Ford Add to Reading List Source URL: www.pacificp.com Language: English - Date: 2012-12-21 18:46:04 Contract law Warranty Implied warranty
7	EVALUATION OF UNDERFILL IN FLIP CHIP AND BGA ON PC BOARDS USING 3V RECONSTRUCTION AND THROUGHTRANSMISSION IMAGING Janet E. Semmens Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Electronic engineering Electromagnetism Electrical engineering Acoustic microscopy Microscopy Electronics manufacturing Flip chip X-rays Void Integrated circuit Solder Printed circuit board
8	MICROELECTRONICS ASSEMBLY Microelectronics Assembly With over four decades of experience in high reliability hybrid and RF technologies, NEO Tech has emerged as North America’s largest microelectronics assembler. The m Add to Reading List Source URL: www.neotech.com Language: English - Date: 2016-01-20 13:47:56 Semiconductor device fabrication Solder Reliability Integrated circuit Welding Wire bonding Flip chip Ball grid array Flux
9	「維基夥伴獎學金」獎助生成果報告書簡報檔 Backside Via Hole and Flip-Chip Packaging of GaAs MMICs for W-Band Applications Adviser：Prof. Edward Yi Chang Add to Reading List Source URL: diamondprj.nctu.edu.tw Language: English - Date: 2015-08-26 02:29:40 Semiconductor device fabrication Semiconductor devices Integrated circuits Monolithic microwave integrated circuit Packaging Reliability Integrated circuit packaging Integrated circuit Flip chip Gallium arsenide Transistor
10	Microsoft Word - MXP7205VW Rev.Cdoc Add to Reading List Source URL: www.memsic.com Language: English - Date: 2013-03-14 17:42:45 Computer buses Serial Peripheral Interface Bus Microcontrollers Digital systems Transducers Accelerometers Analog-to-digital converter Chip select Sensor Raspberry Pi Flip-flop