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Wafer
Results: 777

#	Item
51	General Use (Self‐Checkout by SNF Labmembers) ‐ Page 1 Badger Name AFM Tip ‐ DNP‐20 AFM Tip ‐ TESP Amber Bottle (4 Add to Reading List Source URL: snf.stanford.edu Language: English - Date: 2016-04-11 15:29:03 Semiconductor device fabrication Cleanroom Wafer
52	Produktblatt_CMP2016.indd Add to Reading List Source URL: www.screening-fab.com Language: English - Date: 2016-06-30 03:47:51 Semiconductor device fabrication Wafer KLA-Tencor Etching Applied Materials Silicon Saxony
53	Produktblatt_Cleaning2016.indd Add to Reading List Source URL: www.ipms.fraunhofer.de Language: English - Date: 2016-06-30 03:44:06 Semiconductor device fabrication Wafer KLA-Tencor Fraunhofer Society
54	Copy of Session Schedule Combined Master.xlsx Add to Reading List Source URL: www.iwlpc.com Language: English - Date: 2016-08-15 13:37:41 Semiconductor device fabrication Integrated circuits Packaging Microtechnology Wafer-level packaging Three-dimensional integrated circuit Embedded Wafer Level Ball Grid Array SUSS MicroTec System in package Chip-scale package Through-silicon via Microelectromechanical systems
55	Reviews J. A. Rogers et al. Flexible Electronic Building Blocks Add to Reading List Source URL: rogers.matse.illinois.edu Language: English - Date: 2008-07-13 07:46:47 Nanoelectronics Mesoscopic physics Semiconductor devices Nanomaterials Inorganic compounds Nanowire Gallium arsenide Polydimethylsiloxane Nanoimprint lithography Wafer Microfabrication Quantum dot
56	Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Electronics manufacturing Packaging Microtechnology Semiconductor device fabrication Wafer bonding SUSS MicroTec Wafer Microelectromechanical systems Acoustic microscopy Silicon on insulator Eutectic bonding Capacitive micromachined ultrasonic transducers
57	ultrasound, acoustic imaging, wafer gaps, MEMS ~. Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Semiconductor device fabrication Wafer Acoustic microscopy Microelectromechanical systems Die Wafer dicing Radio frequency microelectromechanical system
58	Microcontact Printing: Arrays of Silicon Micro/Nanostructures Formed in Suspended Configurations for Deterministic Assembly Using Flat and RollerType Stamps (Small) Add to Reading List Source URL: rogers.matse.illinois.edu Language: English - Date: 2011-03-01 06:52:52 Microtechnology Semiconductor device fabrication Microcontact printing Polydimethylsiloxane Crystalline silicon Etching Wafer Solar cell Silicon Gallium nitride Photolithography
59	Electronics-Updated(Feb2016) Add to Reading List Source URL: www.edb.gov.sg Language: English - Date: 2016-08-18 03:39:38 Semiconductor companies Semiconductor device fabrication GlobalFoundries STMicroelectronics NXP Semiconductors UTAC Group Wafer Infineon Technologies Singapore Fabless manufacturing Hitachi Temasek Holdings
60	Management of Voids in Processing of Bonded Wafers Dr. Shari Farrens, Chief Scientist, EV Group Inc. Dr. Lawrence W. Kessler, President, Sonoscan, Inc. Abstract This paper discusses the origination and detection of bondi Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Semiconductor device fabrication Microtechnology Acoustic microscopy Wafer Void Chemical-mechanical planarization Microfabrication Microelectromechanical systems Megasonic cleaning Photolithography Etching