Semiconductor device modeling

Results: 31



#Item
1Fast Process Variation Analysis in Nano-Scaled Technologies Using Column-Wise Sparse Parameter Selection Hassan Ghasemzadeh Mohammadi∗ , Pierre-Emmanuel Gaillardon∗ , Majid Yazdani† , Giovanni De Micheli∗ Integra

Fast Process Variation Analysis in Nano-Scaled Technologies Using Column-Wise Sparse Parameter Selection Hassan Ghasemzadeh Mohammadi∗ , Pierre-Emmanuel Gaillardon∗ , Majid Yazdani† , Giovanni De Micheli∗ Integra

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Source URL: majid.yazdani.me

Language: English - Date: 2015-08-19 06:57:43
2FRAUNHOFER INSTI TUTE FOR I NTEGRATED SYSTEMS AND DEVICE TECHNOLOGY IISB  TECHNOLOGY S IMULATION THE TECHNOLOGY SIMULATION DEPARTMENT

FRAUNHOFER INSTI TUTE FOR I NTEGRATED SYSTEMS AND DEVICE TECHNOLOGY IISB TECHNOLOGY S IMULATION THE TECHNOLOGY SIMULATION DEPARTMENT

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Source URL: www.iisb.fraunhofer.de

Language: English - Date: 2016-06-08 05:52:49
3Variability-Resistant Software Through Improved Sensing & Modeling: Compiler Directed Strategies Rajesh K. Gupta  Outline

Variability-Resistant Software Through Improved Sensing & Modeling: Compiler Directed Strategies Rajesh K. Gupta Outline

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Source URL: mesl.ucsd.edu

Language: English - Date: 2013-03-22 17:03:50
4

PDF Document

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Source URL: www.europractice.stfc.ac.uk

Language: English - Date: 2011-04-22 07:39:08
5Today, disciplines as programming and electronics become highly transversal, blurring old boundaries and merging different fields of knowledge. Fashion has been already highly affected by this radical change. Therefore,

Today, disciplines as programming and electronics become highly transversal, blurring old boundaries and merging different fields of knowledge. Fashion has been already highly affected by this radical change. Therefore,

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Source URL: volumesparis.org

Language: English - Date: 2015-01-31 10:49:40
6FRAUNHOFER INSTI TUTE FOR I NTEGRATED SYSTEMS AND DEVICE TECHNOLOGY IISB  TECHNOLOGY S IMULATION THE TECHNOLOGY SIMULATION DEPARTMENT

FRAUNHOFER INSTI TUTE FOR I NTEGRATED SYSTEMS AND DEVICE TECHNOLOGY IISB TECHNOLOGY S IMULATION THE TECHNOLOGY SIMULATION DEPARTMENT

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Source URL: www.iisb.fraunhofer.de

Language: English - Date: 2015-06-09 13:41:07
73D IC WORKING GROUP MEETING OCTOBER 16, 2013 3D IC Working Group Meeting Agenda  2:00 pm

3D IC WORKING GROUP MEETING OCTOBER 16, 2013 3D IC Working Group Meeting Agenda  2:00 pm

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Source URL: www.gsaglobal.org

Language: English - Date: 2014-01-22 10:41:26
8FAB LAB BCN Barcelona, Spain www.fablab.es < World

FAB LAB BCN Barcelona, Spain www.fablab.es < World

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Source URL: cba.mit.edu

Language: English - Date: 2011-12-13 18:53:05
9Techniques and Tools for Collaborative Thermal and Mechanical Modeling of 3D Ics Kamal Karimanal Cielution LLC

Techniques and Tools for Collaborative Thermal and Mechanical Modeling of 3D Ics Kamal Karimanal Cielution LLC

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Source URL: www.gsaglobal.org

Language: English - Date: 2014-01-22 10:41:49
10Extraction Solutions for 3D Stacks Dusan Petranovic Interconnect Modeling Technologist Design2Silicon Division

Extraction Solutions for 3D Stacks Dusan Petranovic Interconnect Modeling Technologist Design2Silicon Division

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Source URL: www.gsaglobal.org

Language: English - Date: 2014-07-24 00:48:59