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Wafer backgrinding
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#	Item
1	F R A U N H O F E R re s ear c h I n s t i t u t ion for M i c ro s y s t em s an d So l i d S tat e Te c hno l o g ie s E M F T 2 1 Add to Reading List Source URL: www.emft.fraunhofer.de Language: English - Date: 2015-11-12 01:37:49 Semiconductor device fabrication Electronic engineering Technology Electromagnetism Wafer backgrinding Wafer Integrated circuit packaging Roll-to-roll processing Integrated circuit Wafer dicing
2	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden YEARS Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2016-05-25 07:28:49 Semiconductor device fabrication Integrated circuits Electronic engineering Electronics Electromagnetism Packaging Three-dimensional integrated circuit Through-silicon via Fraunhofer Society Wafer backgrinding Wafer
3	Low-Cost 3D Chip Stacking with ThruChip Wireless Connections [removed] [removed] [removed] Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2014-08-04 13:35:25 Electronic engineering Dynamic random-access memory Wafer backgrinding ANT Wafer Three-dimensional integrated circuit Through-silicon via Semiconductor device fabrication Technology Electronics
4	3D IC integration and ESD: “Not the ESD you grew up with!” Stephen Fairbanks Managing Director Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:25 Physics Electricity Electrical safety Electrical breakdown Electrostatics Electrostatic discharge Three-dimensional integrated circuit Through-silicon via Wafer backgrinding Electromagnetism Semiconductor device fabrication Integrated circuits
5	j431 Index a acoustic microscopy 406, 407 – bonded wafer thickness, measuring 417 Add to Reading List Source URL: www.wiley-vch.de Language: English - Date: 2014-03-31 21:03:45 Technology Three-dimensional integrated circuit Wafer backgrinding Wafer dicing Wafer Through-silicon via Microelectromechanical systems SUSS MicroTec Chemical-mechanical planarization Semiconductor device fabrication Microtechnology Electronics
6	Ziptronix and Customer Pursue Lower-Cost 3D Memory With DBI® Wafer Bonding and Interconnect Technology Ability to Replace Die Stacking with High-strength Wafer Stacking Simplifies Process Flows, Increases Interconnect D Add to Reading List Source URL: www.ziptronix.com Language: English - Date: 2012-12-12 11:53:15 Electronics Integrated circuit Wafer Through-silicon via Silicon Three-dimensional integrated circuit Wafer backgrinding Semiconductor device fabrication Chemistry Microtechnology