Failure modes of electronics

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1	CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A. Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Microscopy Electronics manufacturing Manufacturing Economy Business Acoustic microscopy Flip chip Solder Reliability Integrated circuit Bump Microscope
2	April[removed]Flex Crack Mitigation by Bill Sloka, Ceramic Technical Consultant As part of continuous process improvement at KEMET, most failure modes caused by the capacitor manufacturing Add to Reading List Source URL: www.kemet.com Language: English - Date: 2014-03-17 16:58:08 Electromagnetism Electronic engineering Surface-mount technology Printed circuit board Ceramic capacitor Filter capacitor Adobe Flex Depanel Electronics manufacturing Capacitors Electronics
3	PDF Document Add to Reading List Source URL: www.ifte.de Language: English - Date: 2006-04-19 03:35:04 Physics Electromigration Integrated circuits Electronic design Semiconductors Semiconductor device fabrication Physics of failure Failure modes of electronics Electronic engineering Electromagnetism Electronic design automation