Low-Cost 3D Chip Stacking with ThruChip Wireless Connections [removed] [removed] [removed]

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Date: 2014-08-04 13:35:25 Electronic engineering Dynamic random-access memory Wafer backgrinding ANT Wafer Three-dimensional integrated circuit Through-silicon via Semiconductor device fabrication Technology Electronics		Low-Cost 3D Chip Stacking with ThruChip Wireless Connections [removed] [removed] [removed] Add to Reading List Source URL: www.hotchips.org Download Document from Source Website File Size: 1,72 MB Share Document on Facebook