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Electronic engineering / Dynamic random-access memory / Wafer backgrinding / ANT / Wafer / Three-dimensional integrated circuit / Through-silicon via / Semiconductor device fabrication / Technology / Electronics


Low-Cost 3D Chip Stacking with ThruChip Wireless Connections [removed] [removed] [removed]
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Document Date: 2014-08-04 13:35:25


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File Size: 1,72 MB

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