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31	S T EN CIL CL EAN ER The stencil cleaner of Solder Chemistry was developed with the aim to meet the demands of our customers. Many years of experience in the SMT and steady conversation with users of solder pastes have b Add to Reading List Source URL: www.solderchemistry.com Language: English - Date: 2007-12-17 08:34:58 Visual arts Solder paste Communication design Manufacturing Solder Stencil Electronics manufacturing Stencil printing
32	CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A. Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Microscopy Electronics manufacturing Manufacturing Economy Business Acoustic microscopy Flip chip Solder Reliability Integrated circuit Bump Microscope
33	SV540 Leading in Vapor Phase Technology Economy Vapor Phase Soldering Machine for Individual and Series Production Add to Reading List Source URL: www.ibl-tech.com Language: English - Date: 2016-01-05 12:59:28 Electronic engineering Manufacturing Engineering Electronics manufacturing Solder Reflow soldering Quad Flat Package Chiller Surface-mount technology Solder paste
34	SOLDERING FLUX PRO SELECTIVE Type ISOA RE L0 GENERAL DATA PRO Selective is an flux for electronics for the special requests of modern machine Add to Reading List Source URL: www.solderchemistry.com Language: English - Date: 2007-12-17 08:34:12 Business Manufacturing Electronics manufacturing Electronic engineering Selective soldering Flux Soldering Solder Datasheet Wave soldering Soldering iron
35	Microsoft Word - Lead Testing Policy EJB_2_.docx Add to Reading List Source URL: bethlehem-pa.gov Language: English - Date: 2016-05-16 04:00:02 Chemistry Matter Bethlehem Pennsylvania Copper Solder Bethlehem Mineralogy
36	C. Schmetterer, H. Flandorfer, Ch.L. Lengauer, J.-P. Bros, and H. Ipser, “The System Ga-Ni: New phases in the Ga-rich part”, Intermetallics, B. Huber and K.W. Richter, „Observation of th Add to Reading List Source URL: www.mch.aoc.univie.ac.at Language: English - Date: 2011-09-09 08:27:05 Chemistry Solder Intermetallic CALPHAD Thermodynamic system Lead(II) chloride
37	B. Huber, K.W. Richter, H. Flandorfer, A.Mikula and H. Ipser, „Thermodynamic Characterization of liquid alloys with demixing tendency: Bi-Ga”, Int. J. Mat. Res., 99, 18-23, C. Schmetterer, H. Flandor Add to Reading List Source URL: www.mch.aoc.univie.ac.at Language: English - Date: 2009-05-28 05:03:16 Chemistry Nature Metallurgy Solder CALPHAD Alloy Tin Matter
38	LO T P A S T E S CTyp ISOC Die Lotpaste SOLDER CHEMISTRY SC 150 ist die neueste, einzigartige Kreation, speziell für das Löten in der Dampfphase (vapor phase) und unter Schutzgas konzipiert. Ihrer Entwick Add to Reading List Source URL: www.solderchemistry.com Language: German - Date: 2010-06-22 08:03:47
39	LO T P A S T E S CISOC; RE L0 Die Lotpaste SOLDER CHEMISTRY SC 170 ist ein ausgereiftes High-Tech-Produkt, das für alle SMT-Anwendungen bestens geeignet ist. Ihrer Entwicklung liegen nicht nur langjährige Add to Reading List Source URL: www.solderchemistry.com Language: German - Date: 2010-06-22 08:03:47
40	CSP and micro-BGA Process and Damage Assessment with Acoustic Micro Imaging (AMI) Steven R. Martell and J.E. Semmens SONOSCAN IncE. Pratt Blvd. Elk Grove Village, IL 60007 Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Electronic engineering Electrical engineering Electromagnetism Semiconductor device fabrication Packaging Electronics manufacturing Ball grid array Surface-mount technology Solder Reflow soldering Integrated circuit packaging Reliability