Semiconductor package

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81	G:Mkt_outine_dwgsOFFICIAL_DRAWINGSJEDEC_SOICM14AMKT-M14Arev13 Model (1) Add to Reading List Source URL: www.fairchildsemi.com Language: English - Date: 2013-03-19 05:34:23 Electromagnetism Integrated circuits Schmitt trigger Small-outline integrated circuit Series Dual in-line package Fairchild Semiconductor JEDEC Self-aligned gate Electronic engineering Electronics Digital electronics
82	PDF Document Add to Reading List Source URL: www.sigrity.com Language: English - Date: 2001-12-06 18:32:34 Semiconductor device fabrication Electronics manufacturing Ball grid array Integrated circuit packaging Capacitor Flip chip Bumpless Build-up Layer Integrated circuit Chip scale package Technology Electronics Electronic engineering
83	PDF Document Add to Reading List Source URL: nepp.nasa.gov Language: English - Date: 2005-07-22 21:03:59 Semiconductor device fabrication Electronics manufacturing Integrated circuits Multi-chip module Chip scale package Ball grid array Printed circuit board Dual in-line package Three-dimensional integrated circuit Electronics Electronic engineering Electromagnetism