Plasma etching

Results: 62



#Item
1Application Note  Xe plasma FIB (i-FIB) Delayering technology using water as Gas-Assisting Etching

Application Note Xe plasma FIB (i-FIB) Delayering technology using water as Gas-Assisting Etching

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Source URL: www.orsayphysics.com

Language: English - Date: 2016-06-28 10:32:08
    2Control of Ion Energy in a Capacitively Coupled Reactive Ion Etcher H. M. Park , C. Garvin, D. S. Grimard and J. W. Grizzle Electronics Manufacturing and Control Systems Laboratory, Dept. of Electrical Engineering and C

    Control of Ion Energy in a Capacitively Coupled Reactive Ion Etcher H. M. Park , C. Garvin, D. S. Grimard and J. W. Grizzle Electronics Manufacturing and Control Systems Laboratory, Dept. of Electrical Engineering and C

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    Source URL: web.eecs.umich.edu

    Language: English - Date: 2016-04-25 13:15:14
    3A Demonstration of Broadband RF Sensing: Empirical Polysilicon Etch Rate Estimation in a Lam 9400 Etch Tool Craig Garvin and J. W. Grizzle Department of Electrical Engineering and Computer Science, University of Michigan

    A Demonstration of Broadband RF Sensing: Empirical Polysilicon Etch Rate Estimation in a Lam 9400 Etch Tool Craig Garvin and J. W. Grizzle Department of Electrical Engineering and Computer Science, University of Michigan

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    Source URL: web.eecs.umich.edu

    Language: English - Date: 2016-04-25 13:15:11
    4Compensation for transient chamber wall condition using realtime plasma density feedback control in an inductively coupled plasma etcher Pete I. Klimecky, J. W. Grizzle, and Fred L. Terry, Jr. Department of Electrical En

    Compensation for transient chamber wall condition using realtime plasma density feedback control in an inductively coupled plasma etcher Pete I. Klimecky, J. W. Grizzle, and Fred L. Terry, Jr. Department of Electrical En

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    Source URL: web.eecs.umich.edu

    Language: English - Date: 2016-04-25 13:15:14
    5High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECS

    High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECS

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    Source URL: web.eecs.umich.edu

    Language: English - Date: 2016-04-25 13:15:12
    6WALL STATE EFFECTS ON Cl2 POLY-SI RIE: REAL-TIME MEASUREMENTS, MECHANISMS, AND FEEDBACK CONTROL SOLUTIONS Pete I. Klimecky, Jessy W. Grizzle, and Fred L. Terry, Jr. University of Michigan/EECS Dept. , RmBeal A

    WALL STATE EFFECTS ON Cl2 POLY-SI RIE: REAL-TIME MEASUREMENTS, MECHANISMS, AND FEEDBACK CONTROL SOLUTIONS Pete I. Klimecky, Jessy W. Grizzle, and Fred L. Terry, Jr. University of Michigan/EECS Dept. , RmBeal A

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    Source URL: web.eecs.umich.edu

    Language: English - Date: 2016-04-25 13:15:14
    7FLARION Series Plasma Reactors  The FLARION series plasma reactors are custom designed for plasma-enhanced chemical vapour deposition (PECVD), plasma etching (PE), reactive or deep reactive ion etching (RIE, DRIE), or su

    FLARION Series Plasma Reactors The FLARION series plasma reactors are custom designed for plasma-enhanced chemical vapour deposition (PECVD), plasma etching (PE), reactive or deep reactive ion etching (RIE, DRIE), or su

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    Source URL: www.plasmionique.com

    Language: English - Date: 2016-05-17 17:54:17
      8Tin removal from extreme ultraviolet collector optics by inductively coupled plasma reactive ion etching H. Shin,a兲 S. N. Srivastava, and D. N. Ruzicb兲 Center for Plasma Material Interactions, University of Illinois

      Tin removal from extreme ultraviolet collector optics by inductively coupled plasma reactive ion etching H. Shin,a兲 S. N. Srivastava, and D. N. Ruzicb兲 Center for Plasma Material Interactions, University of Illinois

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      Source URL: cpmi.illinois.edu

      Language: English - Date: 2015-04-22 08:46:31
        9Environmentally Friendly Low Pressure Plasma Nanocoatings for Headsets Eva Rogge, MSc  Nano4SME workshop

        Environmentally Friendly Low Pressure Plasma Nanocoatings for Headsets Eva Rogge, MSc Nano4SME workshop

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        Source URL: www.minacned.nl

        Language: English - Date: 2014-06-05 03:45:48
        10Progress in NUCLEAR SCIENCE and TECHNOLOGY, Vol. 1, pImprovement of Crystal Quality of a Homoepitaxially Grown Diamond Layer Using Plasma Etching Treatment for a Diamond Substrate Yuta KONNO1*, Junichi H

        Progress in NUCLEAR SCIENCE and TECHNOLOGY, Vol. 1, pImprovement of Crystal Quality of a Homoepitaxially Grown Diamond Layer Using Plasma Etching Treatment for a Diamond Substrate Yuta KONNO1*, Junichi H

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        Source URL: www.aesj.or.jp

        - Date: 2011-03-15 04:26:49