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#	Item
411	FRAUNHOFER-INSTITUT FÜR ZUVERLÄSSIGKEIT UND MIKROINTEGRATION J OIN THE T EAM ! Job opportunities @ Fraunhofer IZM-ASSID in Dresden/Moritzburg WHO WE ARE: Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-08 14:28:22 Materials science Fraunhofer Society Wafer bonding Through-silicon via Wafer Deep reactive-ion etching Semiconductor device fabrication Microtechnology Electronics
412	1 Intracontinental reworking in the Capricorn Orogen, Western Australia: the 1680–1620 Ma Mangaroon Orogeny* S. SHEPPARD†, S. A. OCCHIPINTI# AND D. R. NELSON Add to Reading List Source URL: www.gsa.org.au Language: English - Date: 2011-06-07 23:04:33 Microprobe Microtechnology Technology Science Microscopes Measuring instruments Spectroscopy
413	Instant Monitoring of Food Quality “Applications of spectroscopy from the farm to the fork” Dilusha Silva Microelectronics Research Group, School of Electrical, Electronic and Computer Engineering, Add to Reading List Source URL: www.ioa.uwa.edu.au Language: English - Date: 2013-04-11 05:38:10 Microelectromechanical systems Transducers Technology Engineering Physics Microtechnology Electrical engineering Mechanical engineering
414	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-13 17:05:57 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
415	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2013-01-18 04:01:57 Technology Electronics manufacturing Chemical bonding Wafer bonding Microelectromechanical systems Deep reactive-ion etching Wafer Through-silicon via EV Group Semiconductor device fabrication Materials science Microtechnology
416	PDF Document Add to Reading List Source URL: spie.org Language: English - Date: 2015-04-13 10:58:59 Extreme ultraviolet lithography Extreme ultraviolet Microtechnology Immersion lithography Computational lithography Interference lithography Photoresist Photomask College of Nanoscale Science and Engineering Materials science Electromagnetic radiation Technology
417	2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM) Wollongong, Australia, July 9-12, 2013 Micro-Force Sensor by Active Control of a Comb-Drive Abdenbi Mohand Ousaid, Sinan Haliyo, St´epha Add to Reading List Source URL: www.cim.mcgill.ca Language: English - Date: 2013-11-08 17:21:27 Transducers Condensed matter physics Microtechnology Mechanical engineering Energy harvesting Piezoelectricity Atomic force microscopy Photodiode Pressure sensor Physics Electromagnetism Technology
418	Y–Y E A • • • • • Add to Reading List Source URL: spie.org Language: English - Date: 2015-04-13 09:40:24 SPIE Semiconductor device fabrication Extreme ultraviolet lithography Computational lithography Immersion lithography Nanoimprint lithography Applied Materials Synopsys Lithography Materials science Microtechnology Technology
419	Cymer ASML w reg - to the M Add to Reading List Source URL: spie.org Language: English - Date: 2015-04-13 09:12:57 SPIE SEMATECH Photolithography Extreme ultraviolet lithography Lithography Applied Materials Photonics Nanoimprint lithography Semiconductor device fabrication Materials science Technology Microtechnology
420	4 LCD illustrations v04_OL Add to Reading List Source URL: www.christiedigital.com Language: English - Date: 2013-09-16 10:26:16 Optoelectronics Technology Computer hardware Liquid crystal displays Microtechnology Digital Light Processing LCD projector Liquid crystal on silicon 3LCD Projectors Input/output Display technology

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