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Interposer
Results: 29

#	Item
11	3D IC Readiness GSA 3D IC Workshop October 22, 2014 Charles Woychik Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-10-23 00:17:41 Electronics Electronic engineering Interposer Three-dimensional integrated circuit JEDEC Wire bonding Semiconductor device fabrication Integrated circuits Microtechnology
12	qctconnect.com QUALCOMM CONFIDENTIAL AND PROPRIETARY Roadmap for Design and EDA Infrastructure for 3D Products Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:30:09 Semiconductor device fabrication Technology Three-dimensional integrated circuit Interposer Qualcomm Dynamic random-access memory Back end of line Application-specific integrated circuit Through-silicon via Integrated circuits Electronics Electronic engineering
13	DDR3 Bus Mixed Signal Interposers For use with Agilent[removed]X-Series Mixed Signal Oscilloscopes FS2388 DDR3 DIMM Mixed Signal Interposer The Mixed Signal Interposer (MSI) connects key Add to Reading List Source URL: www.futureplus.com Language: English - Date: 2013-08-09 16:47:20 Electronics SDRAM Laboratory equipment DDR3 SDRAM DIMM Oscilloscope Test probe Nvidia Ion Agilent Technologies Electronic test equipment Technology Measuring instruments
14	Open3D Standards Development @ Si2 Nick English VP, Development Silicon Integration Initiative (Si2) Austin, TX 78759 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-02-04 09:46:55 Electromagnetism Silicon Integration Initiative Physical design Integrated circuit design Open standard Application-specific integrated circuit Interposer Standard Performance Evaluation Corporation Si2 Integrated circuits Electronic engineering Electronics
15	Next Generation Stacked Memory Systems Alok Gupta NVIDIA, Santa Clara, CA 1 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2015-01-23 15:54:47 Dynamic random-access memory Electronic engineering Interposer Semiconductor device fabrication Technology Through-silicon via Computer memory Integrated circuits Electronics
16	3D IC WORKING GROUP MEETING JULY 17, 2013 3D IC Working Group Meeting Agenda  2:00 pm Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:26 Electronic engineering Computer memory Technology Fabless semiconductor companies Three-dimensional integrated circuit Back end of line Rambus Dynamic random-access memory Interposer Semiconductor device fabrication Electronics Integrated circuits
17	3DIC in Production, Making Chip-Stacking a Reality in the FPGA Market Glenn O’Rourke Vice President of Manufacturing Technology & Product Quality October 2013 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:36 Semiconductor device fabrication Fabless semiconductor companies Reconfigurable computing Xilinx Field-programmable gate array Through-silicon via Interposer Three-dimensional integrated circuit Integrated circuits Electronic engineering Electronics
18	GSA 3D Business Model Subgroup Javier DeLaCruz Problem Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:59 Electronic engineering Semiconductor fabrication plant GlobalFoundries Wafer Interposer Technology Semiconductor device fabrication Electronics TSMC
19	A Comparison of 3D Package Designs: Traditional Organic Substrates and Advanced Silicon Interposers GSA 3DIC Stacking Working Group Meeting July 17, 2013 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:42:15 Integrated circuits Electronic engineering Technology Fabless semiconductor companies Rambus Three-dimensional integrated circuit Dynamic random-access memory Interposer Back end of line Computer memory Electronics Semiconductor device fabrication
20	Innovative Common Technologies to Support State-of-the-Art Products SMAFTI Package Technology Features Wide-Band and Large-Capacity Memory KURITA Yoichiro, SOEJIMA Koji, KAWANO Masaya Add to Reading List Source URL: www.nec.com Language: English - Date: 2013-10-01 21:40:28 Technology System in package Semiconductor device fabrication Ball grid array System on a chip Chip scale package Interposer Flip chip Three-dimensional integrated circuit Electronic engineering Integrated circuits Electronics

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