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Interposer
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#	Item
1	Electroless and electrolytic copper plating of glass interposer combined with metal oxide adhesion layer for manufacturing 3D RF devices Zhiming Liu, Hailuo Fu, Sara Hunegnaw, Jun Wang, Michael Merschky, Tafadzwa Magaya Add to Reading List Source URL: www.atotech.com Language: English - Date: 2017-03-20 07:48:05
2	NXQ4000 MASK ALIGNER Microelectronics LED/HB LED 3D IC WLP 2.5D Interposer Add to Reading List Source URL: neutronixinc.com Language: English - Date: 2015-11-18 12:12:09
3	3D Packaging Synthetic Quartz Substrate and Interposer for High Frequency Applications Add to Reading List Source URL: www.agcem.com Language: English - Date: 2014-12-07 23:52:52
4	Paper Title 3D Si Interposer Design and Electrical Performance Study Authors Mandy (Ying) Ji Add to Reading List Source URL: www.designcon.com Language: English - Date: 2014-12-22 13:34:10 Electronic circuits Electronic design automation Jitter Synchronization Signal integrity Printed circuit board Integrated circuit design Phase noise Field-programmable gate array Electronics Electronic engineering Electromagnetism
5	Visio-2.5D Interposer_★.vsd Add to Reading List Source URL: pc.watch.impress.co.jp - Date: 2015-04-20 23:45:15
6	Amkor’s Next Generation Packaging Solutions … the future is now! Paul Silvestri I Director, TSV Product Development Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-10-23 00:19:08 Semiconductor device fabrication Microtechnology SDRAM Field-programmable gate array Xilinx 3DS Interposer Through-silicon via Three-dimensional integrated circuit Electronic engineering Integrated circuits Electronics
7	Business Models to Support Supply Chain Readiness for Mainstream 2.5D & 3D Technologies Presented by Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:42:11 Electronic engineering Three-dimensional integrated circuit Chip scale package Wafer dicing Wafer Microelectromechanical systems Interposer EV Group Through-silicon via Semiconductor device fabrication Electronics Microtechnology
8	Market Trend with Packaging Technology Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:29:56 Integrated circuits Microtechnology Three-dimensional integrated circuit Ball grid array Quad-flat no-leads package Chip scale package Interposer Amkor Technology Flip chip Semiconductor device fabrication Electronics Electronic engineering
9	Xilinx SSI Technology Concept to Silicon Development Overview Shankar Lakka Aug 27th, 2012 Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:30:14 Fabless semiconductor companies Reconfigurable computing Xilinx Field-programmable gate array Semiconductor device fabrication Through-silicon via Interposer Electronic engineering Integrated circuits Electronics
10	The Challenge of Moore’s Law for Fabless Semiconductor Companies Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:29:38 Electronics Semiconductor device fabrication Field-programmable gate array Xilinx Through-silicon via Interposer System on a chip Advanced Micro Devices Electronic engineering Integrated circuits Fabless semiconductor companies