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Fabrication
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#	Item
191	THE COLLECTIVE CONSEQUENCES OF SCIENTIFIC FRAUD: AN ANALYSIS OF BIOMEDICAL RESEARCH Philippe Mongeon1 and Vincent Larivière1 1 Add to Reading List Source URL: www.researchgate.net Language: English Scientific misconduct Science in society Academia Science and technology Retraction Diederik Stapel Eric Poehlman Arturo Casadevall Fabrication Retraction Watch Anil Potti
192	Communication Fabrication and Photocatalytic Activities of Morphology-Controlled Titania Nanoobject Arrays by Block Copolymer Templatesa Juan Peng, Xue Li, Dong Ha Kim,* Wolfgang Knoll Add to Reading List Source URL: www.polymer.fudan.edu.cn Language: English - Date: 2007-10-28 19:21:50 Chemistry Catalysis Photochemistry Sunscreening agents Photocatalysis Sol-gel Titania Hydrogen chloride Titanium dioxide Polymer
193	New Back Side Tabbing Paste for PERC Application with Improved Passivation Layer Protection Yi Yang, Devidas Balu Raskar, Guang Zhai, Lindsey Karpowich, Chilong Chen, Weiming Zhang Yi Yang \| HPT Innovation \| May 23, 2016 Add to Reading List Source URL: www.heraeus.com Language: English - Date: 2016-08-12 05:26:02 Chemistry Business Economy Semiconductor device fabrication Corrosion prevention Passivation Dutch East India Company Adhesion Layer Vanadium Soldering Flux
194	RGPCKW PRODUCT BRIEF E N G I N E E R I N G I N N O V A T I O N Add to Reading List Source URL: www.ridgetopgroup.com Language: English - Date: 2015-07-18 01:30:09 Electronic engineering Semiconductor device fabrication Electromagnetism Electronics Integrated circuits Semiconductor devices Electronic design Integrated circuit design Integrated circuit Reliability Coupon Application-specific integrated circuit
195	Journal of Undergraduate Research 3, Atomic Layer Deposited Al2 O3 Film on Si(100) as Buffer Layer for Hfx Ti1−x O2 Deposition Adam L. Kueltzo Thornton Fractional North High School, Calumet City, IL 60409 Add to Reading List Source URL: jur.phy.uic.edu Language: English - Date: 2009-11-24 11:31:03 Thin film deposition Semiconductor device fabrication Atomic layer deposition Matter Manufacturing Chemistry Thin film ALD Vacuum deposition
196	EUROMATSymposia Structure/Area C: Processing Title: Coatings and Surface Modification Techniques C.1 Organizer Add to Reading List Source URL: euromat2017.fems.eu Language: English - Date: 2016-06-28 04:12:30 Thin film deposition Coatings Chemistry Matter Manufacturing Materials science Semiconductor device fabrication Thin films Plasma processing Thin film Plating Physical vapor deposition
197	Product Spotlight SOL9350 Series New P+ Contact Paste for N-type Cells N-type cell designs have demonstrated high efficiencies for Add to Reading List Source URL: www.heraeus.com Language: English - Date: 2016-08-11 05:24:23 Semiconductor device fabrication Chemistry Heraeus Materials science Physical chemistry Wafer Viscometer Photovoltaics Deep reactive-ion etching
198	U.S. Semiconductor Manufacturing: Industry Trends, Global Competition, Federal Policy Add to Reading List Source URL: www.fas.org Language: English - Date: 2016-06-30 19:55:39 Business Technology Economy Semiconductor device fabrication Semiconductor Industry Association ON Semiconductor Semiconductor sales leaders by year TSMC Fabless manufacturing Semiconductor industry Integrated device manufacturer STMicroelectronics
199	Microsoft Word - Sonoscan - Copyrighted - SMTA ChinaAutomating C-SAM Process Control - From Lab to Fab and Back-End.doc Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Semiconductor device fabrication Materials science Technology Acoustic microscopy Electromagnetism Wafer SMIF Microelectromechanical systems
200	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden YEARS Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2016-05-25 07:28:49 Semiconductor device fabrication Integrated circuits Electronic engineering Electronics Electromagnetism Packaging Three-dimensional integrated circuit Through-silicon via Fraunhofer Society Wafer backgrinding Wafer

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