Electromigration

Results: 49



#Item
11Copyright © 2012 American Scientific Publishers All rights reserved Printed in the United States of America Journal of Low Power Electronics

Copyright © 2012 American Scientific Publishers All rights reserved Printed in the United States of America Journal of Low Power Electronics

Add to Reading List

Source URL: euler.ecs.umass.edu

Language: English - Date: 2012-11-06 11:44:32
12SISPAD 2012, September 5-7, 2012, Denver, CO, USA  Multi-Via Electromigration Lifetime Model Di-an Li, Zhong Guan, Malgorzata Marek-Sadowska  Sani R. Nassif

SISPAD 2012, September 5-7, 2012, Denver, CO, USA Multi-Via Electromigration Lifetime Model Di-an Li, Zhong Guan, Malgorzata Marek-Sadowska Sani R. Nassif

Add to Reading List

Source URL: in4.iue.tuwien.ac.at

Language: English - Date: 2013-02-12 08:39:10
    13Constant Voltage Electromigration for Advanced Interconnects TECHNICAL BRIEF After decades of reliance on Constant Current Electromigration (CIEM) to predict the electromigration lifetime of back end of line (BEOL) inter

    Constant Voltage Electromigration for Advanced Interconnects TECHNICAL BRIEF After decades of reliance on Constant Current Electromigration (CIEM) to predict the electromigration lifetime of back end of line (BEOL) inter

    Add to Reading List

    Source URL: www.cascademicrotech.com

    Language: English - Date: 2015-04-17 19:38:56
      14Constant Voltage Electromigration for Advanced Interconnects TECHNICAL BRIEF After decades of reliance on Constant Current Electromigration (CIEM) to predict the electromigration lifetime of back end of line (BEOL) inter

      Constant Voltage Electromigration for Advanced Interconnects TECHNICAL BRIEF After decades of reliance on Constant Current Electromigration (CIEM) to predict the electromigration lifetime of back end of line (BEOL) inter

      Add to Reading List

      Source URL: www.cmicro.com

      Language: English - Date: 2015-04-17 19:38:56
        15Microsoft Word - 2013_PhD_Call_For_Nominations_Flyer.doc

        Microsoft Word - 2013_PhD_Call_For_Nominations_Flyer.doc

        Add to Reading List

        Source URL: eds.ieee.org

        Language: English - Date: 2013-04-04 15:04:13
        16APRIL 2010 VOL. 17, NO. 2 ISSN: TABLE OF

        APRIL 2010 VOL. 17, NO. 2 ISSN: TABLE OF

        Add to Reading List

        Source URL: eds.ieee.org

        Language: English - Date: 2012-02-07 15:25:22
        17

        "Failure-Assessment Software For Circuit-Card Assemblies", M. Osterman, and T. Stadterman. Proc. for the Annual Reliability and Maintainability Symposium, pp, JanFailure Assessment Software for Circuit Ca

        Add to Reading List

        Source URL: www.calce.umd.edu

        Language: English - Date: 2007-09-07 15:11:53
        18CALL FOR PAPERS  ROCS Workshop Reliability Of Compound Semiconductors  Monday May 18, 2015

        CALL FOR PAPERS ROCS Workshop Reliability Of Compound Semiconductors Monday May 18, 2015

        Add to Reading List

        Source URL: www.jedec.org

        Language: English - Date: 2015-01-26 10:05:38
        19Vt Variation Effects on Lifetime Reliability Brian Greskamp Smruti R. Sarangi Josep Torrellas

        Vt Variation Effects on Lifetime Reliability Brian Greskamp Smruti R. Sarangi Josep Torrellas

        Add to Reading List

        Source URL: iacoma.cs.uiuc.edu

        Language: English - Date: 2010-12-24 11:30:50
        20eFuse Design and Reliability William R. Tonti FIEEE IEEE Director of Future Directions 445 Hoes lane, Piscataway NY[removed]removed]

        eFuse Design and Reliability William R. Tonti FIEEE IEEE Director of Future Directions 445 Hoes lane, Piscataway NY[removed]removed]

        Add to Reading List

        Source URL: rs.ieee.org

        Language: English - Date: 2011-07-27 09:23:59