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Copper interconnect
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1	FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS CENTER NANOELECTRONIC TECHNOLOGIES (CNT) INTERCONNECTS HIGH-K DEVICES Add to Reading List Source URL: www.ipms.fraunhofer.de Language: English - Date: 2016-04-01 03:01:20 Semiconductor device fabrication Copper interconnect Chemical-mechanical planarization Plating GlobalFoundries Wafer Back end of line Fraunhofer Society Copper plating Silicon Saxony
2	FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS CENTER NANOELECTRONIC TECHNOLOGIES (CNT) 2 1 Add to Reading List Source URL: www.screening-fab.com Language: English - Date: 2016-02-10 06:01:49 Semiconductor device fabrication Copper interconnect Chemical-mechanical planarization Plating Wafer GlobalFoundries Back end of line Fraunhofer Society
3	COPPER METALLIZATION OF SEMICONDUCTOR INTERCONNECTS – -- ISSUES AND PROSPECTS Uziel Landau Chemical Engineering Department and The Yeager Center for Electrochemical Sciences Add to Reading List Source URL: www.l-chem.com Language: English - Date: 2004-04-07 12:01:23 Coatings Electronics manufacturing Semiconductor device fabrication Electrical engineering Copper interconnect Plating Electroplating Copper plating Wafer Electromagnetism Electronics Electronic engineering
4	Formation of Highly Reliable Cu/Low-k Interconnects by Using CVD Co Barrier in Dual Damascene Structures Hye Kyung Jung, Hyun-Bae Lee, Matsuda Tsukasa, Eunji Jung, Jong-Ho Yun, Jong Myeong Lee, Gil-Heyun Choi, Siyoung Ch Add to Reading List Source URL: www.appliedmaterials.com Language: English - Date: 2014-05-12 14:31:02 Semiconductor device fabrication Electromigration Electronic design automation Copper interconnect Titanium nitride Thin film Flux Materials science Electronic engineering Chemistry
5	NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT Add to Reading List Source URL: www.appliedmaterials.com Language: English - Date: 2014-01-26 17:00:01 Materials science Thin film deposition MOSFET Chemical vapor deposition Low-k dielectric Silicide Titanium nitride Metal gate Copper interconnect Chemistry Semiconductor device fabrication Technology
6	Robust TSV ViaMiddle and ViaReveal Process Integration Accomplished through Characterization and Management of Sources of Variation Add to Reading List Source URL: www.appliedmaterials.com Language: English - Date: 2014-05-27 18:47:55 Microtechnology Chemical-mechanical planarization Etching Back end of line Copper interconnect Through-silicon via Wafer Chemical vapor deposition Three-dimensional integrated circuit Semiconductor device fabrication Electronics Technology
7	Reference List by Module[removed]Arizona Board of Regents for The University of Arizona Manufacturing Overview Add to Reading List Source URL: www.erc.arizona.edu Language: English - Date: 1999-12-02 13:42:10 Microtechnology Chemical-mechanical planarization Etching Polishing Semiconductor Solid Copper interconnect Semiconductor device fabrication Materials science Technology
8	Industrial and Corporate Change, Volume 18, Number 6, pp. 1249–1284 doi:[removed]icc/dtp044 Advance Access published November 4, 2009 The many faces of absorptive capacity: spillovers of copper interconnect Add to Reading List Source URL: kwanghui-public.s3.amazonaws.com Language: English - Date: 2012-07-31 00:43:18 Knowledge Management Science Dietary minerals Knowledge spillover Semiconductor device fabrication Copper Absorptive capacity Organizational theory Research and development
9	SIMTech Technical Report (PT[removed]JT) Chemical Mechanical Planarization Add to Reading List Source URL: maltiel-consulting.com Language: English - Date: 2013-04-20 18:07:00 Technology Chemical-mechanical planarization Copper interconnect Microelectromechanical systems Etching Surface finishing Surface micromachining Shallow trench isolation Photolithography Semiconductor device fabrication Materials science Microtechnology

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