HIGH CURRENT PROPERTIES OF A MICROSPRING CONTACT FOR FLIP CHIP PACKAGING

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Date: 2010-04-28 10:14:48 Solder Flip chip Semiconductor device fabrication Solid Switch Electromigration Thermal copper pillar bump Electronic engineering Electronics Condensed matter physics		HIGH CURRENT PROPERTIES OF A MICROSPRING CONTACT FOR FLIP CHIP PACKAGING Add to Reading List Source URL: www.ee.washington.edu Download Document from Source Website File Size: 1,25 MB Share Document on Facebook