JOURNAL OF APPLIED PHYSICS VOLUME 93, NUMBER 9

First Page		Document Content
Date: 2010-12-09 11:08:13 Technology Silicon on insulator Thermal oxidation Ion implantation Wafer Microelectromechanical systems Silicon on sapphire Smart Cut Epitaxy Semiconductor device fabrication Materials science Microtechnology		JOURNAL OF APPLIED PHYSICS VOLUME 93, NUMBER 9 Add to Reading List Source URL: www.soitec.com Download Document from Source Website File Size: 1,22 MB Share Document on Facebook

	Evaluation of Silicon on Insulator (SOI) Bonded Wafers Using Automated Acoustic Micro Imaging Janet E. Semmens and Bryan P. Schackmuth Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA DocID: 1qB4B - View Document
	Smart Laboratories Cut Energy Consumption More Than Half A U.S. Department of Energy Better Buildings Challenge Demonstration Project Why target laboratories? Research universities have large carbon footprints because l DocID: 1pwfQ - View Document
	School-wide Title I Program Targeted Assistance Title I Program Non Title I Program School Performance Plan (SPP) SMART Goals School – Level Goal #1 Cut the bottom quartile by 50% in math and reading as measured by th DocID: 1nSUn - View Document
	Energy-Smart Buildings Demonstrating how information technology can cut energy use and costs of real estate portfolios 2 DocID: 1h3i6 - View Document
	World Leading: Autonomous, Deterministic Control of Distributed Energy Resources. Successful smart grids manage large volumes of fast-changing data. The traditional operator-in-theloop approach won’t cut it anymore. To DocID: 1fE3n - View Document