NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT

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Date: 2014-01-26 17:00:01 Materials science Thin film deposition MOSFET Chemical vapor deposition Low-k dielectric Silicide Titanium nitride Metal gate Copper interconnect Chemistry Semiconductor device fabrication Technology		NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT Add to Reading List Source URL: www.appliedmaterials.com Download Document from Source Website File Size: 2,22 MB Share Document on Facebook

	FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS CENTER NANOELECTRONIC TECHNOLOGIES (CNT) INTERCONNECTS HIGH-K DEVICES DocID: 1pmt2 - View Document
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	COPPER METALLIZATION OF SEMICONDUCTOR INTERCONNECTS – -- ISSUES AND PROSPECTS Uziel Landau Chemical Engineering Department and The Yeager Center for Electrochemical Sciences DocID: 106lm - View Document
	Formation of Highly Reliable Cu/Low-k Interconnects by Using CVD Co Barrier in Dual Damascene Structures Hye Kyung Jung, Hyun-Bae Lee, Matsuda Tsukasa, Eunji Jung, Jong-Ho Yun, Jong Myeong Lee, Gil-Heyun Choi, Siyoung Ch DocID: GE0U - View Document
	NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT DocID: GAtv - View Document