Back to Results
First PageMeta Content
Semiconductor device fabrication / Electromigration / Electronic design automation / Copper interconnect / Titanium nitride / Thin film / Flux / Materials science / Electronic engineering / Chemistry


Formation of Highly Reliable Cu/Low-k Interconnects by Using CVD Co Barrier in Dual Damascene Structures Hye Kyung Jung, Hyun-Bae Lee, Matsuda Tsukasa, Eunji Jung, Jong-Ho Yun, Jong Myeong Lee, Gil-Heyun Choi, Siyoung Ch
Add to Reading List

Document Date: 2014-05-12 14:31:02

Open Document

File Size: 724,90 KB

Share Result on Facebook
UPDATE