A new low-temperature high-aspect-ratio MEMS process using plasma activated wafer bonding

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Date: 2013-09-17 15:11:17 Technology Microelectromechanical systems Etching Wafer Microfabrication Deep reactive-ion etching Chemical-mechanical planarization Thermal oxidation Silicon on insulator Semiconductor device fabrication Materials science Microtechnology		A new low-temperature high-aspect-ratio MEMS process using plasma activated wafer bonding Add to Reading List Source URL: deepblue.lib.umich.edu Download Document from Source Website File Size: 1,79 MB Share Document on Facebook

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