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801	I Design Advanced Micro and Nanosystems Vol. 3. Microengineering of Metals and Ceramics. Edited by H. Baltes, O. Brand, G. K. Fedder, C. Hierold, J. Korvink, O. Tabata Copyright © 2005 WILEY-VCH Verlag GmbH & Co. KGaA, Add to Reading List Source URL: www.wiley-vch.de Language: English - Date: 2005-06-08 01:56:12 Microtechnology Architectural design Integrated circuits Engineering Integrated circuit design LIGA Microsystem Microfluidics Application-specific integrated circuit Technology Electronic engineering Design
802	1 1 Evaluation of Mechanical Properties of MEMS Materials and Their Standardization Toshiyuki Tsuchiya, Department of Micro Engineering, Kyoto University, Japan Add to Reading List Source URL: www.wiley-vch.de Language: English - Date: 2007-11-21 05:43:30 Nanotechnology Mechanical engineering Microtechnology Microelectromechanical systems Strength of materials Ultimate tensile strength Cantilever Fatigue Tensile testing Materials science Physics Elasticity
803	SEMI-FINISHED BONDED SUBSTRATES Silicon LiTaO3 100 µm Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 05:44:20 Electronics manufacturing Wafer bonding Microelectromechanical systems Anodic bonding Eutectic bonding Wafer Adhesive bonding Glass frit bonding Direct bonding Microtechnology Technology Electronics
804	Microsoft PowerPoint - Materials Role STOA Brussels KBock [Kompatibilitätsmodus] Add to Reading List Source URL: www.europarl.europa.eu Language: English - Date: 2012-07-12 03:44:15 Microtechnology Electromagnetism Electrical engineering Mechanical engineering Microelectromechanical systems Sensor Norwegian Institute of Technology Nanoparticle Fraunhofer Group for Microelectronics Transducers Technology Materials science
805	Capabilities Service Details Specific application Add to Reading List Source URL: www.ipms.fraunhofer.de Language: English - Date: 2015-01-15 19:37:11 Semiconductor device fabrication Nanotechnology Etching Microelectromechanical systems Transducers Surface micromachining Bulk micromachining Deep reactive-ion etching Chemical-mechanical planarization Materials science Microtechnology Technology
806	F R A U N H O F E R I n s t i t u t e F o R E l e c t roni c N A no s y s t e m s E N A S System Packaging Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 04:48:28 Electronics manufacturing Semiconductor device fabrication Wafer bonding Chemical bonding Microelectromechanical systems Reactive bonding Glass frit bonding Three-dimensional integrated circuit Micro-Opto-Electro-Mechanical Systems Microtechnology Technology Electronics
807	Microsoft Word - 037_Qian Add to Reading List Source URL: www.nafems.de Language: English - Date: 2014-08-29 05:40:00 Microtechnology Hysteresis Magnetic ordering Systems theory Electromagnetism Ansys Microbeam Microelectromechanical systems Science Physics Materials science Radiobiology
808	FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS CENTER NANOELECTRONIC TECHNOLOGIES (CNT) 1 2 Add to Reading List Source URL: www.ipms.fraunhofer.de Language: English - Date: 2015-01-15 03:29:57 Technology Chemistry Fraunhofer Society Chemical vapor deposition Deep reactive-ion etching Nanotechnology Etching Semiconductor device fabrication Materials science Microtechnology
809	Electronics & Instrumentation: Devices and Systems 6MeV Medical Linear Accelerator-JV1 Add to Reading List Source URL: www.csir.res.in Language: English - Date: 2014-12-04 02:22:20 Electromagnetism Physics Microtechnology Measuring instruments Klystron Microelectromechanical systems Pressure sensor Technology Sensors Transducers
810	Schedule of Events Tuesday, October 5th, 2010 (evening) In collaboration with CMC Microsystems Brookstreet Hotel, Kanata 6:00 p.m. Add to Reading List Source URL: itac.ca Language: English - Date: 2014-12-19 06:05:51 Microelectromechanical systems Transducers Microsystem Technology Engineering Physics Microtechnology Electrical engineering Mechanical engineering

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