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Microtechnology
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#	Item
791	ComplexEIT ComplexEIT EARTO Annual Meeting May 30, 2008 Add to Reading List Source URL: www.earto.eu Language: English - Date: 2011-11-03 05:48:28 Minatec Business intelligence Grenoble SWOT analysis Innovation IMEC Business cluster Tone cluster Fraunhofer Society Music Strategic management Microtechnology
792	Two-Photon Polymerization (2PP) 10 µm Technology Features  Enabler for real 3D microstructures Add to Reading List Source URL: www.isc.fraunhofer.de Language: English - Date: 2014-07-16 07:41:07 Microtechnology Laser 100 nanometres 1 micrometre Technology Physics Science Photonics Lenses Microlens
793	SEMI-FINISHED BONDED SUBSTRATES CONSISTING OF LITHIUMTANTALATE AND SILICON Silicon Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 14:05:56 Electronics manufacturing Wafer bonding Semiconductor device fabrication Wafer Direct bonding Anodic bonding Microtechnology Electronics Technology
794	SCREEN PRINTING FOR MEMS PACKAGING AND WAFER BONDING Contact Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 11:24:45 Semiconductor device fabrication Electronics manufacturing Printmaking Wafer Microelectromechanical systems Screen printing Solder paste Three-dimensional integrated circuit Stencil Microtechnology Technology Electronics
795	SEMI-FINISHED BONDED SUBSTRATES: SOI-WAFER (SILICON ON INSULATOR) 1 Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 09:59:22 Semiconductor device fabrication Electronics manufacturing Wafer bonding Wafer Direct bonding Silicon on insulator Thermal oxidation Etching Eutectic bonding Microtechnology Electronics Materials science
796	2014 Ieee DanIeL e. noBLe aWaRD foR eMeRgIng TeChnoLogIeS Sponsored by the Motorola Foundation GABRIEL M. REBEIZ Add to Reading List Source URL: mtt.org Language: English - Date: 2014-07-18 03:13:29 Technology Electromagnetism Microelectromechanical systems Radio frequency Institute of Electrical and Electronics Engineers Microtechnology RF MEMS Engineering
797	ORMOCER® resists for microoptics 100 µm Application  Add to Reading List Source URL: www.isc.fraunhofer.de Language: English - Date: 2014-07-16 07:41:07 Nanoimprint lithography Ultraviolet Technology Microtechnology Lenses Microlens
798	SEMI-FINISHED BONDED SUBSTRATES: SILICON ON GLASS (SOG) µm up. The precise specifications of each Contact Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 06:53:22 Electronics manufacturing Wafer bonding Semiconductor device fabrication Wafer Chemical bonding Anodic bonding Direct bonding 100 micrometres Microelectromechanical systems Microtechnology Electronics Technology
799	Business Innovation Observatory Clean Technologies Energy harvesting Add to Reading List Source URL: ec.europa.eu Language: English - Date: 2014-10-30 05:21:13 Building automation Microtechnology EnOcean Wireless sensor network Home automation Thermoelectric generator ANT Wireless Harvest Technology Wireless networking Energy harvesting
800	THERMOCOMPRESSION WAFER BONDING WITH THIN METAL LAYERS Contact Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 06:04:42 Technology Wafer bonding Thermocompression bonding Anodic bonding Direct bonding Chemical bond Reactive bonding Eutectic bonding Microtechnology Electronics Electronics manufacturing

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