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Microtechnology
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#	Item
471	MEMS Working Group June 12, 2013 Agenda Time Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:44:46 Microelectromechanical systems Transducers Electromagnetism Technology Engineering Microelectromechanical system oscillator Microtechnology Electrical engineering Mechanical engineering
472	MCU SOLUTIONS Energy Harvesting Solutions www.silabs.com/energy-harvesting Add to Reading List Source URL: www.silabs.com Language: English - Date: 2012-11-16 16:40:03 Computing Wireless sensor network Fabless semiconductor companies Energy harvesting Microtechnology Sensor node Silicon Laboratories Universal Serial Bus Solar cell Technology Wireless networking Computer hardware
473	MEMS technologies and products Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:45:26 Electrical engineering Mechanical engineering Microelectromechanical systems Transducers Wireless sensor network Accelerometer Gyroscope Sensor fusion Airbag Technology Microtechnology Sensors
474	Business @ a glance TDK is one of the leading electronic component manufacturers in the world. 48％ Add to Reading List Source URL: www.global.tdk.com Language: English - Date: 2015-01-15 20:19:08 Capacitors Transducers Electrical engineering Microtechnology Energy storage TDK Electrolytic capacitor Surface-mount technology Piezoelectricity Electromagnetism Energy Technology
475	F R A U N H O F E R - I N S T I T U T F Ü R C he m ische T echno l o g ie I C T Microreaction technology – analysis, development and optimisation of chemical processes Add to Reading List Source URL: www.daad.org Language: English - Date: 2011-01-19 09:34:13 Microtechnology Chemical engineering Chemical reactors Microreactor Micro process engineering Nanotechnology Chemical reaction Catalysis Calorimeter Chemistry Materials science Microfluidics
476	GSA MEMS Working Group Meeting Samsung, San Jose, CA \| March 20, 2013 MEMS Working Group Meeting Minutes of the GSA MEMS Working Group meeting March 20, 2013 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:45:02 Electrical engineering Mechanical engineering Microelectromechanical systems Transducers Electromagnetism Analog Devices Qualcomm Semiconductor Equipment and Materials International RF MEMS Microtechnology Technology Materials science
477	Microsoft PowerPoint - Standards Related to 3D Packaging (Jasbir Bath, IPC) [Compatibility Mode] Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-02-04 09:46:57 Electronics Three-dimensional integrated circuit Wafer Packaging and labeling Integrated circuit packaging Through-silicon via Semiconductor device fabrication Technology Microtechnology
478	Technology Steering Committee Dr. Naveed Sherwani, Chairman August 8th, 2012 Agenda Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:47:41 Microtechnology Three-dimensional integrated circuit Wafer Fabless semiconductor company Microelectromechanical systems Semiconductor Equipment and Materials International Multigate device Global Semiconductor Alliance Semiconductor device fabrication Technology Materials science
479	Design, Test, Integration & Packaging of MEMS/MOEMS General Chair: Pascal NOUET, LIRMM, France Local Chair: Frédérick MAILLY, LIRMM, France Publication Chair: Benoit CHARLOT, IES, France Add to Reading List Source URL: dtip-mems.org Language: English - Date: 2014-10-01 12:49:54 Micro-Opto-Electro-Mechanical Systems Microfabrication Microelectromechanical systems Simulation Microtechnology Materials science Technology
480	MEMS Working Group June 18, 2014 Agenda Time Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-06-18 22:12:43 Electrical engineering Mechanical engineering Microelectromechanical systems Transducers Milpitas California Technology GlobalFoundries PMC-Sierra Synopsys Microtechnology Fabless semiconductor companies Materials science

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