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Etch
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#	Item
111	SiCl4/Cl2 plasmas: a new chemistry to etch high-k material selectively to Si-based alloys P. Bodarta, G. Cungea, C. Petit-Etiennea, M. Darnona, M. Haassa, S. Bannab, O.Jouberta and T.Lillb a CNRS-LTM, Add to Reading List Source URL: www-leti.cea.fr Language: English - Date: 2012-05-24 09:08:30 Plasma processing Technology Physics Etching Plasma CL2 Semiconductor device fabrication Materials science Microtechnology
112	DEVELOPMENT OF (Al)GaN RECESS ETCH FOR EMODE POWER HEMTs G. MANNAERT, V. PARASCHIV, B. DE JAEGER, M. VAN HOVE, M. DEMAND, S. DECOUTERE, W. BOULLART IMEC, KAPELDREEF 75, LEUVEN, B-3000, BELGIUM © IMEC[removed]CONFIDENTIA Add to Reading List Source URL: www-leti.cea.fr Language: English - Date: 2012-05-24 09:13:54 Gallium nitride IMEC Ohmic contact Aluminium gallium nitride Light-emitting diode Gan Chinese BCL3 Sulfur hexafluoride Chemistry Nitrides Semiconductor device fabrication
113	DEVELOPMENT OF (Al)GaN RECESS ETCH FOR EMODE POWER HEMTs G. MANNAERT, V. PARASCHIV, B. DE JAEGER, M. VAN HOVE, M. DEMAND, S. DECOUTERE, W. BOULLART IMEC, KAPELDREEF 75, LEUVEN, B-3000, BELGIUM © IMEC[removed]CONFIDENTIA Add to Reading List Source URL: www-leti.cea.fr Language: English - Date: 2012-05-24 09:13:54 Gallium nitride IMEC Ohmic contact Aluminium gallium nitride Light-emitting diode Gan Chinese BCL3 Sulfur hexafluoride Chemistry Nitrides Semiconductor device fabrication
114	SiCl4/Cl2 plasmas: a new chemistry to etch high-k material selectively to Si-based alloys P. Bodarta, G. Cungea, C. Petit-Etiennea, M. Darnona, M. Haassa, S. Bannab, O.Jouberta and T.Lillb a CNRS-LTM, Add to Reading List Source URL: www-leti.cea.fr Language: English - Date: 2012-05-24 09:08:30 Plasma processing Technology Physics Etching Plasma CL2 Semiconductor device fabrication Materials science Microtechnology
115	© IMEC[removed] FEOL ETCH CHALLENGES, FROM PLANAR METAL GATES TOWARDS Add to Reading List Source URL: www-leti.cea.fr Language: English - Date: 2012-05-24 09:07:30 Microtechnology Extreme ultraviolet lithography Transistors Etching Multigate device IMEC Graphene High-k dielectric Polycrystalline silicon Materials science Technology Physics
116	News Release Nanoplas Announces Important New 14nm Order and Joint Development Agreement with CEA-Leti High-selectivity dry-etch for 14nm OEM pilot line will replace wet etch; CEA-Leti to qualify the system for addition Add to Reading List Source URL: www-leti.cea.fr Language: English - Date: 2013-11-27 09:43:38 Technology Etching Plasma processing Microelectromechanical systems Transducers Dry etching Isotropic etching Plasma etching Wafer Semiconductor device fabrication Microtechnology Materials science
117	Chapter[removed]Miscellaneous Etchants Add to Reading List Source URL: nanolab.berkeley.edu Language: English - Date: 2010-09-17 15:08:49 Mineral acids Microtechnology Buffered oxide etch Ethylenediamine pyrocatechol Tetramethylammonium hydroxide Hydrogen chloride Industrial etching Nitric acid Iron(III) chloride Chemistry Etching Chlorides
118	Etch Damage in Magnetic Thin Film Head Materials Add to Reading List Source URL: www.ncnr.nist.gov Language: English - Date: 2014-01-15 16:26:13 RAMAC Seagate Technology Disk read-and-write head 305 Hard disk drives Computer hardware Computer storage media IBM 305 RAMAC
119	Chapter[removed]VLSI Etchants Add to Reading List Source URL: nanolab.berkeley.edu Language: English - Date: 2011-08-05 15:10:22 Technology Etching Plasma processing Microelectromechanical systems Tetramethylammonium hydroxide Buffered oxide etch Plasma etcher Plasma etching Photoresist Materials science Semiconductor device fabrication Microtechnology
120	Technical Data Sheet ALUMA ETCH 185  • Non-sludging Add to Reading List Source URL: www.hillbrothers.com Language: English - Date: 2011-11-02 16:38:50 Microtechnology Semiconductor device fabrication Glass etching Parathyroid hormone Titration Sodium hydroxide Gas tungsten arc welding Chemistry Etching Materials science

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