Electromigration

Results: 49



#Item
31Semiconductor device fabrication / Electromigration / Electronic design automation / Copper interconnect / Titanium nitride / Thin film / Flux / Materials science / Electronic engineering / Chemistry

Formation of Highly Reliable Cu/Low-k Interconnects by Using CVD Co Barrier in Dual Damascene Structures Hye Kyung Jung, Hyun-Bae Lee, Matsuda Tsukasa, Eunji Jung, Jong-Ho Yun, Jong Myeong Lee, Gil-Heyun Choi, Siyoung Ch

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Source URL: www.appliedmaterials.com

Language: English - Date: 2014-05-12 14:31:02
32Emerging technologies / Quantum electronics / Nanomaterials / Quantum dot / Electron / Electromigration / X10 / Scanning tunneling microscope / Tantalum / Physics / Condensed matter physics / Technology

Department of Electrical & Computer Engineering PhD Candidacy Examination 2013 Nanoelectronics 3 hours maximum Page 1 of 2

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Source URL: umanitoba.ca

Language: English - Date: 2014-09-12 13:55:19
33Electronic design automation / Surface chemistry / Science / Electromigration / Kinetic Monte Carlo / Monte Carlo method / Adatoms / Migration / Statistical mechanics / Physics / Probability and statistics

CALIFORNIA STATE SCIENCE FAIR 2013 PROJECT SUMMARY Name(s) Jamie R. Lesser

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Source URL: www.usc.edu

Language: English - Date: 2013-04-13 17:39:18
34Microscopes / Electron microscopy / Electromigration / Electronic design automation / Image processing / Transmission electron microscopy / Pixel / Single-photon emission computed tomography / Projection / Medicine / Scientific method / Science

JOURNAL OF APPLIED PHYSICS VOLUME 87, NUMBER 9 1 MAY 2000

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Source URL: math.nist.gov

Language: English - Date: 2005-08-09 13:42:04
35Physics / Electromigration / Power network design / Integrated circuit design / Current density / Reliability / Physical design / EM / Current crowding / Electronic engineering / Electronic design automation / Electromagnetism

White Paper Understand and Avoid Electromigration (EM) & IR-drop in Custom IP Blocks November 2011

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Source URL: www.synopsys.com

Language: English - Date: 2014-11-07 14:37:36
36Civil law / Appeal procedure before the European Patent Office / Grant procedure before the European Patent Office / Appeal / Copper / Inventive step and non-obviousness / Unity of invention / European Patent Convention / Electromigration / European Patent Organisation / Law / Patent law

BESCHWERDEKAMMERN DES EUROPÄISCHEN PATENTAMTS BOARDS OF APPEAL OF THE EUROPEAN PATENT

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Source URL: www.epo.org

Language: English - Date: 2011-06-14 11:50:50
37Design / Semiconductors / Failure / Heat transfer / Electronics manufacturing / Reliability / Electromigration / R-value / Measuring instrument / Electronic engineering / Electronic design automation / Technology

Hierarchical Thermal and Electromigration Analysis for Cell-based Designs Srini Krishnamoorthy, Vishak Venkatraman, Thomas Burd, James Pistole, Yuri Apanovich*, Rajit Chandra Advanced Micro Devices, One AMD Place, Sunnyv

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Source URL: www.gradient-da.com

Language: English - Date: 2012-07-18 18:42:06
38Electronic design / Semiconductor devices / Integrated circuits / Resistor / Electromigration / Integrated circuit design / MOSFET / Reliability / Current source / Electronic engineering / Electromagnetism / Electrical engineering

Microsoft Word - SwitchingConstraintDrivenThermalAndReliabilityAnalysis

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Source URL: www.gradient-da.com

Language: English - Date: 2011-03-16 16:56:33
39Chemical elements / Transition metals / Thin film deposition / Dietary minerals / Chemical vapor deposition / Electromigration / Cobalt / Titanium nitride / Copper / Chemistry / Matter / Semiconductor device fabrication

Improving Copper Electromigration Resistance Raymond N. Virtis, Air Products and Chemical, Inc., Allentown PA.

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Source URL: www.mri.psu.edu

Language: English - Date: 2010-08-25 15:48:58
40Materials science / Design / Maintenance / Electronic design / Survival analysis / Physics of failure / Reliability / Failure causes / Electromigration / Systems engineering / Reliability engineering / Failure

"Failure-Assessment Software For Circuit-Card Assemblies", M. Osterman, and T. Stadterman. Proc. for the Annual Reliability and Maintainability Symposium, pp[removed], Jan 1999.

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Source URL: www.calce.umd.edu

Language: English - Date: 2007-09-07 15:11:53
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