Electromigration

Results: 49



#Item
31Formation of Highly Reliable Cu/Low-k Interconnects by Using CVD Co Barrier in Dual Damascene Structures Hye Kyung Jung, Hyun-Bae Lee, Matsuda Tsukasa, Eunji Jung, Jong-Ho Yun, Jong Myeong Lee, Gil-Heyun Choi, Siyoung Ch

Formation of Highly Reliable Cu/Low-k Interconnects by Using CVD Co Barrier in Dual Damascene Structures Hye Kyung Jung, Hyun-Bae Lee, Matsuda Tsukasa, Eunji Jung, Jong-Ho Yun, Jong Myeong Lee, Gil-Heyun Choi, Siyoung Ch

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Source URL: www.appliedmaterials.com

Language: English - Date: 2014-05-12 14:31:02
32Department of Electrical & Computer Engineering PhD Candidacy Examination 2013 Nanoelectronics 3 hours maximum Page 1 of 2

Department of Electrical & Computer Engineering PhD Candidacy Examination 2013 Nanoelectronics 3 hours maximum Page 1 of 2

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Source URL: umanitoba.ca

Language: English - Date: 2014-09-12 13:55:19
33CALIFORNIA STATE SCIENCE FAIR 2013 PROJECT SUMMARY Name(s)  Jamie R. Lesser

CALIFORNIA STATE SCIENCE FAIR 2013 PROJECT SUMMARY Name(s) Jamie R. Lesser

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Source URL: www.usc.edu

Language: English - Date: 2013-04-13 17:39:18
34JOURNAL OF APPLIED PHYSICS  VOLUME 87, NUMBER 9 1 MAY 2000

JOURNAL OF APPLIED PHYSICS VOLUME 87, NUMBER 9 1 MAY 2000

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Source URL: math.nist.gov

Language: English - Date: 2005-08-09 13:42:04
35White Paper  Understand and Avoid Electromigration (EM) & IR-drop in Custom IP Blocks November 2011

White Paper Understand and Avoid Electromigration (EM) & IR-drop in Custom IP Blocks November 2011

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Source URL: www.synopsys.com

Language: English - Date: 2014-11-07 14:37:36
36BESCHWERDEKAMMERN DES EUROPÄISCHEN PATENTAMTS BOARDS OF APPEAL OF THE EUROPEAN PATENT

BESCHWERDEKAMMERN DES EUROPÄISCHEN PATENTAMTS BOARDS OF APPEAL OF THE EUROPEAN PATENT

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Source URL: www.epo.org

Language: English - Date: 2011-06-14 11:50:50
37Hierarchical Thermal and Electromigration Analysis for Cell-based Designs Srini Krishnamoorthy, Vishak Venkatraman, Thomas Burd, James Pistole, Yuri Apanovich*, Rajit Chandra Advanced Micro Devices, One AMD Place, Sunnyv

Hierarchical Thermal and Electromigration Analysis for Cell-based Designs Srini Krishnamoorthy, Vishak Venkatraman, Thomas Burd, James Pistole, Yuri Apanovich*, Rajit Chandra Advanced Micro Devices, One AMD Place, Sunnyv

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Source URL: www.gradient-da.com

Language: English - Date: 2012-07-18 18:42:06
38Microsoft Word - SwitchingConstraintDrivenThermalAndReliabilityAnalysis

Microsoft Word - SwitchingConstraintDrivenThermalAndReliabilityAnalysis

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Source URL: www.gradient-da.com

Language: English - Date: 2011-03-16 16:56:33
39Improving Copper Electromigration Resistance Raymond N. Virtis, Air Products and Chemical, Inc., Allentown PA.

Improving Copper Electromigration Resistance Raymond N. Virtis, Air Products and Chemical, Inc., Allentown PA.

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Source URL: www.mri.psu.edu

Language: English - Date: 2010-08-25 15:48:58
40

"Failure-Assessment Software For Circuit-Card Assemblies", M. Osterman, and T. Stadterman. Proc. for the Annual Reliability and Maintainability Symposium, pp[removed], Jan 1999.

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Source URL: www.calce.umd.edu

Language: English - Date: 2007-09-07 15:11:53