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2.5D
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#	Item
51	crosoft Word - 1449A_2642616125465d32_F1.doc Add to Reading List Source URL: www.bmkc.edu.hk Language: English - Date: 2015-03-12 21:51:40 Sham Shui Po The Hong Kong Council of the Church of Christ in China Ying Wa Primary School PTT Bulletin Board System Hong Kong Provinces of the People\'s Republic of China Cheung Sha Wan
52	crosoft Word - 1434E_F5 62055d3246616125.doc Add to Reading List Source URL: www.bmkc.edu.hk Language: English - Date: 2014-12-14 20:24:28 Liwan District Henrietta Secondary School Hong Kong Provinces of the People\'s Republic of China Ang Ui-jin
53	crosoft Word - 1499E_2642616125465d32_F5.doc Add to Reading List Source URL: www.bmkc.edu.hk Language: English - Date: 2015-03-12 21:51:35 Liwan District Henrietta Secondary School Hong Kong Provinces of the People\'s Republic of China Ang Ui-jin
54	Monday 2 June 2014 Tania de Jong Creative Universe Level 1, 68 Clarke St Southbank VIC 3006 Email: [removed] Add to Reading List Source URL: www.pot-pourri.com.au Language: English - Date: 2014-06-04 03:53:51 5D Tania de Jong Pot-Pourri
55	2.5D Dual Contouring: A Robust Approach to Creating Building Models from Aerial LiDAR Point Clouds Qian-Yi Zhou and Ulrich Neumann University of Southern California Add to Reading List Source URL: graphics.usc.edu Language: English - Date: 2012-04-06 16:02:08 Imaging Polygons Euclidean plane geometry 3D modeling Simple polygon Rasterisation Visual arts Terminology 3D computer graphics Visual effects Computer graphics
56	crosoft Word - ACJ1400T_03067\|43063W5d_1016~24456003067\|3q1L_1.0_20130620.DOC Add to Reading List Source URL: tw.transcend-info.com Language: Korean - Date: 2015-04-01 06:23:13
57	Foundry TSV Enablement For 2.5D/3D Chip Stacking Remi Yu, UMC Hot Chips 24 August 27, 2012 Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:29:43 Reconfigurable computing Fabless semiconductor companies Xilinx Semiconductor device fabrication Digital electronics Three-dimensional integrated circuit Field-programmable gate array CMOS Electronic engineering Electronics Integrated circuits
58	3D IC WORKING GROUP MEETING JANUARY 23, 2013 3D IC Working Group Meeting Agenda  1:30 pm Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:26 Project management Technology Electronics Electronic engineering Semiconductor device fabrication Three-dimensional integrated circuit 2.5D
59	Uusien henkilöautojen ensiverotuspäätökset[removed]100 eniten verotettavaksi ilmoitettua mallia CO2 KPL (g/km) 1 NISSAN QASHQAI 1.2 5D TA 85KW Add to Reading List Source URL: www.tulli.fi Language: German - Date: 2015-03-09 04:52:26
60	2.5D Building Modeling by Discovering Global Regularities Qian-Yi Zhou University of Southern California Ulrich Neumann University of Southern California Add to Reading List Source URL: graphics.usc.edu Language: English - Date: 2012-04-06 16:02:08 Spherical coordinate system Golden ratio 3D modeling Geometric primitive 2.5D Mathematics Geometry Numbers Computer graphics