2.5D

Results: 115



#Item
51Sham Shui Po / The Hong Kong Council of the Church of Christ in China / Ying Wa Primary School / PTT Bulletin Board System / Hong Kong / Provinces of the People\'s Republic of China / Cheung Sha Wan

crosoft Word - 1449A_2642616125465d32_F1.doc

Add to Reading List

Source URL: www.bmkc.edu.hk

Language: English - Date: 2015-03-12 21:51:40
52Liwan District / Henrietta Secondary School / Hong Kong / Provinces of the People\'s Republic of China / Ang Ui-jin

crosoft Word - 1434E_F5 62055d3246616125.doc

Add to Reading List

Source URL: www.bmkc.edu.hk

Language: English - Date: 2014-12-14 20:24:28
53Liwan District / Henrietta Secondary School / Hong Kong / Provinces of the People\'s Republic of China / Ang Ui-jin

crosoft Word - 1499E_2642616125465d32_F5.doc

Add to Reading List

Source URL: www.bmkc.edu.hk

Language: English - Date: 2015-03-12 21:51:35
545D / Tania de Jong / Pot-Pourri

Monday 2 June 2014 Tania de Jong Creative Universe Level 1, 68 Clarke St Southbank VIC 3006 Email: [removed]

Add to Reading List

Source URL: www.pot-pourri.com.au

Language: English - Date: 2014-06-04 03:53:51
55Imaging / Polygons / Euclidean plane geometry / 3D modeling / Simple polygon / Rasterisation / Visual arts / Terminology / 3D computer graphics / Visual effects / Computer graphics

2.5D Dual Contouring: A Robust Approach to Creating Building Models from Aerial LiDAR Point Clouds Qian-Yi Zhou and Ulrich Neumann University of Southern California

Add to Reading List

Source URL: graphics.usc.edu

Language: English - Date: 2012-04-06 16:02:08
56

crosoft Word - ACJ1400T_03067|43063W5d_1016~24456003067|3q1L_1.0_20130620.DOC

Add to Reading List

Source URL: tw.transcend-info.com

Language: Korean - Date: 2015-04-01 06:23:13
    57Reconfigurable computing / Fabless semiconductor companies / Xilinx / Semiconductor device fabrication / Digital electronics / Three-dimensional integrated circuit / Field-programmable gate array / CMOS / Electronic engineering / Electronics / Integrated circuits

    Foundry TSV Enablement For 2.5D/3D Chip Stacking Remi Yu, UMC Hot Chips 24 August 27, 2012

    Add to Reading List

    Source URL: www.hotchips.org

    Language: English - Date: 2013-07-28 00:29:43
    58Project management / Technology / Electronics / Electronic engineering / Semiconductor device fabrication / Three-dimensional integrated circuit / 2.5D

    3D IC WORKING GROUP MEETING JANUARY 23, 2013 3D IC Working Group Meeting Agenda  1:30 pm

    Add to Reading List

    Source URL: www.gsaglobal.org

    Language: English - Date: 2014-01-22 10:41:26
    59

    Uusien henkilöautojen ensiverotuspäätökset[removed]100 eniten verotettavaksi ilmoitettua mallia CO2 KPL (g/km) 1 NISSAN QASHQAI 1.2 5D TA 85KW

    Add to Reading List

    Source URL: www.tulli.fi

    Language: German - Date: 2015-03-09 04:52:26
      60Spherical coordinate system / Golden ratio / 3D modeling / Geometric primitive / 2.5D / Mathematics / Geometry / Numbers / Computer graphics

      2.5D Building Modeling by Discovering Global Regularities Qian-Yi Zhou University of Southern California Ulrich Neumann University of Southern California

      Add to Reading List

      Source URL: graphics.usc.edu

      Language: English - Date: 2012-04-06 16:02:08
      UPDATE