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Reconfigurable computing / Fabless semiconductor companies / Xilinx / Semiconductor device fabrication / Digital electronics / Three-dimensional integrated circuit / Field-programmable gate array / CMOS / Electronic engineering / Electronics / Integrated circuits


Foundry TSV Enablement For 2.5D/3D Chip Stacking Remi Yu, UMC Hot Chips 24 August 27, 2012
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Document Date: 2013-07-28 00:29:43

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File Size: 1,23 MB

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Xilinx / GSA 3D Working Group / /

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Foundry TSV Enablement Foundry TSV Process Technology / Foundry TSV Enablement / /

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metal / /

Organization

General Services Administration / /

Person

Remi Yu / /

Technology

html / FPGA / 2.5D/3D Chip / 7 Foundry TSV Enablement Foundry TSV Process Technology / /

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