NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT

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Date: 2014-01-26 17:00:01 Materials science Thin film deposition MOSFET Chemical vapor deposition Low-k dielectric Silicide Titanium nitride Metal gate Copper interconnect Chemistry Semiconductor device fabrication Technology		NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT Add to Reading List Source URL: www.appliedmaterials.com Download Document from Source Website File Size: 2,22 MB Share Document on Facebook

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