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Through-silicon via / Semiconductor device fabrication / Integrated circuits / Three-dimensional integrated circuit


Abstract Minapad 2012_version finale
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Document Date: 2012-03-14 11:06:08

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File Size: 11,11 KB

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City

las Vegas / Geneva / San Francisco / Prague / /

Country

Switzerland / France / United States / /

Facility

Czech Technical University / Institute of Experimental / /

IndustryTerm

frequency applications / 3D integration technologies / 3D integration technology / medical imaging / 3D technology / mature technologies / radiation imaging detectors / /

NaturalFeature

Buena Vista lake / /

OperatingSystem

Microsoft Vista / /

Organization

European Organization for Nuclear Research / Czech Technical University in Prague / Institute of Experimental and Applied Physics / /

Technology

radiation / developing 3D integration technologies / 3D technology / Silicon Via technology / 3D Integration technology / mature technologies / medical imaging / /

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