| Document Date: 2011-11-02 05:26:11
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Facility Thomas Zwick Karlsruhe Institute of Technology / / IndustryTerm high carrier frequencies / carrier frequency / broadband flip chip / higher device / proposed packaging solution / possible packaging solution / flip chip / matched flip chip / thin film technology / semiconductor technologies / feasible solution / antenna integration solutions / consumer products / mmw flip chip / flip-chip / automotive systems / flip chip technology / distance sensing applications / semiconductor chip / asymmetric matching network / digital baseband processors / double flip chip / manufacturing process / / MusicGroup ISM / / Organization US Federal Reserve / Institute of Technology / / Person Thomas Zwick / / Technology semiconductor / radiation / broadband flip chip / Broadband / semiconductor technologies / flip chip / double Flip-Chip / two chips / semiconductor chip / dielectric / 122 GHz flip chip / Microwave / digital baseband processors / simulation / double flip chip / flip chip technology / 122 GHz chip / mmw flip chip / same chip / matched flip chip / thin film technology / integrated circuit / / URL http /
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122 GHz Antenna-Integration in a Plastic Package based on a Flip Chip Interconnect Stefan Beer, Thomas Zwick Karlsruhe Institute of Technology, Institut fuer Hochfrequenztechnik und Elektronik Kaiserstr. 12, 76131 Karlsr