Investor Presentation Q2-2014

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Date: 2014-10-30 11:21:46 Wire bonding Solder Bond Technology Manufacturing Semiconductor device fabrication Flip chip Materials science		Investor Presentation Q2-2014 Add to Reading List Source URL: www.besi.com Download Document from Source Website File Size: 792,49 KB Share Document on Facebook

	CRIMP VS. SOLDER: PROS & CONS Connections More Vital Than Ever Today, a flawed coaxial connection can severely reduce performance on digital systems like ThinNET (EtherNET), Wireless networks like WiFi and WLAN’s and h DocID: 1vnO2 - View Document
	Example 2 – Adafruit 8x16 Dot Matrix FeatherWing on zbit:builder Only 4 solder link wires are needed to attach the Adafruit 8x16 Dot Matrix FeatherWing I2C Display to your BBC micro:bit using zbit:builder! (3V, GND, P DocID: 1vh37 - View Document
	Developing Damage Models for Solder Joints Exposed to Complex Stress States: Influence of Potting, Coating, BGA Mirroring, and Housing on Solder Joint Fatigue Existing stress and damage models designed to capture solder DocID: 1uUPg - View Document
	Kit + 10W Stereo Amplifier not work, first check all external wiring, make sure there are no shorts, then check all the component positions and orientation. Also check all solder joints and make sure there are no DocID: 1uGag - View Document
	Making No-Solder Bezels #Epoxy resins provide a great way to create custom metal bezels and pendant frames without having to solder. This technique sheet covers DocID: 1um6F - View Document