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![]() Date: 2015-04-22 10:49:33Integrated circuits Semiconductor device fabrication Multi-chip module Three-dimensional integrated circuit Electronic design Monolithic microwave integrated circuit Electronic packaging Electronic design automation Electronics Electronic engineering Technology | Add to Reading List |
![]() | Paper Title (use style: paper title)DocID: 1qzVz - View Document |
![]() | Drop-In Monolithic Amplifier DC-1 GHzDocID: 1q4AS - View Document |
![]() | 「維基夥伴獎學金」獎助生成果報告書 簡報檔 Backside Via Hole and Flip-Chip Packaging of GaAs MMICs for W-Band Applications Adviser:Prof. Edward Yi ChangDocID: 1oJN4 - View Document |
![]() | MATEC Web of Conferences 4 0, ) DOI: m atecconf0 6 C Owned by the authors, published by EDP Sciences, 2016 Review of wide band-gap semiconductors technologyDocID: 1nXyu - View Document |
![]() | DenV S080159_MMIC Technology.qxdDocID: 1aOpt - View Document |