Molded interconnect device

Results: 8



#Item
1Engineering / Electromagnetism / Electronic engineering / Molded interconnect device / Electronics manufacturing / LPKF Laser & Electronics / Photonics

Three-Dimensional Circuits LPKF LDS: Laser Direct Structuring for 3D Molded Interconnect Devices Innovative Product Design with MID Technology State-of-the-art technology: a circuit carrier was designed according to

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Source URL: www.lpkf.com

Language: English - Date: 2014-08-08 06:12:03
2Electronic engineering / Engineering / Electromagnetism / Electronics manufacturing / LPKF Laser & Electronics / Printed circuit board / Soldering / Solder / Reflow soldering / Via / ColorCAM / Molded interconnect device

Get PCB Prototypes Sooner with In-House Rapid PCB Prototyping Save Time with In-House Prototyping In-house circuit board prototyping eliminates waiting for external suppliers. With LPKF systems and solutions, even compl

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Source URL: www.lpkf.com

Language: English - Date: 2016-02-16 05:18:44
3Molded interconnect device / Emerging technologies / Metallizing / Printed circuit board / 3D printing / Laser / Software prototyping / LPKF Laser & Electronics

LPKF LDS Prototyping 3D MID Manufacturing Made Easy The Market for 3D Parts is Growing … Molded interconnect devices (MIDs) create new possibilities in product characteristics and production methods. The LDS method an

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Source URL: www.lpkf.com

Language: English
4Packaging materials / Thermoplastics / Manufacturing / Dielectrics / Molded interconnect device / Printed circuit board / Injection molding / Acrylonitrile butadiene styrene / Polypropylene / Technology / Electromagnetism / Plastics

Microsoft Word - Hagberg_empc2007.doc

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Source URL: www.aspact.fi

Language: English - Date: 2014-03-25 03:41:00
5Manufacturing / Plastics industry / Molded interconnect device / Plastics / Injection molding / Printed circuit board / Materials science / Acrylonitrile butadiene styrene / Label / Electromagnetism / Technology / Electronics manufacturing

ASPACT®, a Novel Circuiting Method for Molded Interconnect Devices (MID) Applications T. Kekonen, J. Hagberg, T. Kutilainen Aspocomp Oy Tutkijantie 13, 90570 Oulu, Finnland Zusammenfassung

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Source URL: www.aspact.fi

Language: English - Date: 2014-03-25 03:41:00
6Integrated circuits / Acronyms / Laser / Photonics / Printed circuit board / Application-specific integrated circuit / Molded interconnect device / LPKF Laser & Electronics / Electromagnetism / Electronics / Electronic engineering

3-Dimensional Circuitry Laser Direct Structuring Technology (LPKF-LDS) for Moulded Interconnect Devices Innovative product design through MID technology For a state-of-the-art dental hand-piece the basic attachment boar

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Source URL: www.lpkf.com

Language: English - Date: 2012-09-11 04:55:56
7Electronics manufacturing / Solid freeform fabrication / Electrical engineering / Electronic engineering / Printed circuit board / Laser / Plating / Molded interconnect device / Rapid prototyping / Technology / Physics / Electromagnetism

3-Dimensional Circuitry Laser Direct Structuring Technology (LPKF-LDSTM) for Moulded Interconnect Devices Innovative product design through MID technology For a state-of-the-art dental hand-piece the basic attachment bo

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Source URL: www.lasermicronics.com

Language: English - Date: 2012-11-22 07:25:50
8Optics / LPKF Laser & Electronics / Laser beam welding / Molded interconnect device / Laser cutting / Depanel / Plastic welding / Laser / Ultrasonic welding / Technology / Mechanical engineering / Welding

DeuZert_Logo_4c mit DIN EN ISO[removed]eps

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Source URL: www.lasermicronics.com

Language: English - Date: 2012-11-22 07:22:11
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