TEMPLATE BASED ASSEMBLY FOR SOLID STATE COOLING

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Date: 2007-08-14 19:20:53 Mechanical engineering Microelectromechanical systems Microtechnology Transducers Flip chip Solder Static electricity Integrated circuit Electromagnetism Physics Electrical engineering		TEMPLATE BASED ASSEMBLY FOR SOLID STATE COOLING Add to Reading List Source URL: www.ee.washington.edu Download Document from Source Website File Size: 379,39 KB Share Document on Facebook

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