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![]() Date: 2010-09-17 15:08:49Mineral acids Microtechnology Buffered oxide etch Ethylenediamine pyrocatechol Tetramethylammonium hydroxide Hydrogen chloride Industrial etching Nitric acid Iron(III) chloride Chemistry Etching Chlorides | Add to Reading List |
![]() | High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECSDocID: 1p1ER - View Document |
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![]() | Chapter[removed]Miscellaneous EtchantsDocID: FnTw - View Document |
![]() | Chapter[removed]VLSI EtchantsDocID: FjrJ - View Document |
![]() | Surface Cleaning and Wet Processing Terminology Contributions by Motorola CorporationDocID: uSvf - View Document |