Marvell NanoLab Member login Lab Manual Contents

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Date: 2012-11-20 13:15:45 Microtechnology Microelectromechanical systems Wafer Chemical vapor deposition Deep reactive-ion etching Stepper Reactive-ion etching Plasma etcher Sputtering Semiconductor device fabrication Materials science Technology		Marvell NanoLab Member login Lab Manual Contents Add to Reading List Source URL: nanolab.berkeley.edu Download Document from Source Website File Size: 44,40 KB Share Document on Facebook

	NANO LETTERS Three-Dimensional Nanostructures Formed by Single Step, Two-Photon Exposures through Elastomeric Penrose DocID: 1qceS - View Document
	Control of Ion Energy in a Capacitively Coupled Reactive Ion Etcher H. M. Park , C. Garvin, D. S. Grimard and J. W. Grizzle Electronics Manufacturing and Control Systems Laboratory, Dept. of Electrical Engineering and C DocID: 1q0n7 - View Document
	Product Spotlight SOL9350 Series New P+ Contact Paste for N-type Cells N-type cell designs have demonstrated high efficiencies for DocID: 1pU6D - View Document
	A Demonstration of Broadband RF Sensing: Empirical Polysilicon Etch Rate Estimation in a Lam 9400 Etch Tool Craig Garvin and J. W. Grizzle Department of Electrical Engineering and Computer Science, University of Michigan DocID: 1p6Jz - View Document
	Compensation for transient chamber wall condition using realtime plasma density feedback control in an inductively coupled plasma etcher Pete I. Klimecky, J. W. Grizzle, and Fred L. Terry, Jr. Department of Electrical En DocID: 1p5ql - View Document