NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT

First Page		Document Content
Date: 2014-01-26 17:00:01 Materials science Thin film deposition MOSFET Chemical vapor deposition Low-k dielectric Silicide Titanium nitride Metal gate Copper interconnect Chemistry Semiconductor device fabrication Technology		NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT Add to Reading List Source URL: www.appliedmaterials.com Download Document from Source Website File Size: 2,22 MB Share Document on Facebook

	LETTER pubs.acs.org/NanoLett Softened Elastic Response and Unzipping in Chemical Vapor Deposition Graphene Membranes Carlos S. Ruiz-Vargas,† Houlong L. Zhuang,‡ Pinshane Y. Huang,† Arend M. van der Zande,§ Shivank DocID: 1rWdj - View Document
	Carbon nanotube thin films Esko I. Kauppinen Aalto University School of Science, Department of Applied Physics PO Box 15100, FIAalto, FINLAND Contact e-mail: Indium is currently used as ITO DocID: 1rjvP - View Document
	www.advmat.de REVIEW Ultrathin Films of Single-Walled Carbon Nanotubes for Electronics and Sensors: A Review of Fundamental and DocID: 1r6Vw - View Document
	MATEC Web of Conferences 30, DOI: m atec conf 0 8 C Owned by the authors, published by EDP Sciences, 2015 Deposition and Characterization of the Titanium-Based Coating by a DocID: 1qUVd - View Document
	Letter pubs.acs.org/NanoLett Local Atomic and Electronic Structure of Boron Chemical Doping in Monolayer Graphene Liuyan Zhao,† Mark Levendorf,‡ Scott Goncher,§ Theanne Schiros,∥ Lucia Pálová,§ DocID: 1qGdV - View Document