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Electromagnetism / IEEE Electron Devices Society / Institute of Electrical and Electronics Engineers / IEEE Transactions on Semiconductor Manufacturing / International Electron Devices Meeting / Chenming Hu / Ilesanmi Adesida / Hot carrier injection / Reliability engineering / Semiconductors / Engineering / Electronic engineering


E LECTRON DEVICES S OCIETY IEEE ELECTRON DEVICES SOCIETY JanVol. 11, No. 1
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Document Date: 2012-02-07 15:25:14


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Allentown / KAIST / Piscataway / Provo / Burlington / IMEC / Bern / Austin / East Fishkill / ENSERG / Addis Ababa / Phoenix / Juelich / Chicago / Santa Clara / Dallas / Buffalo / Paris / Washington / D.C. / Bloomington / LAAS / Monterey / Pasadena / New York / Belgrade / /

Company

Vacuum Electronics / Computer Sciences / Naval Research Laboratory / Electronics Engineers Inc. / D. Stojadinovic 2004 IEEE International Vacuum Electronics / TSMC / Microsystem Technologies / GaN Electronics / Al systems / Texas Instruments / Samsung / IBM Corporation / IEEE Electron Devices Society Newsletter 3 2004 International / Integrated Systems Laboratory / on Semiconductor / L-3 Communications / EiHolding Company / Nortel Networks / Analex Corp / Vishay / Seagate Technology Incorporated / IEEE Operations Center EDS / Diodes / NASA Jet Propulsion Laboratory / IBM Semiconductor Research / Northrop Grumman / Low Power CMOS ZigBee Radio / EDS / Philips Semiconductor / The Fifth International Vacuum Electronics / Hertz / Society Newsletter 5 2004 IEEE International Vacuum Electronics / Xerox / Teledyne / Boeing / Palisades Convention Management / Sr. Past / /

Continent

Asia / Europe / Americas / /

Country

United Kingdom / Italy / Spain / Switzerland / Netherlands / Montenegro / France / Korea / Ethiopia / India / Germany / Romania / Serbia / Belgium / Turkey / Austria / United States / Singapore / /

Currency

USD / /

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Event

Natural Disaster / /

Facility

DePauw University / Jindal University of Louisiana / Stanford University / University of Illinois / University of Nis / Renuka P. Jindal University of Louisiana / Phoenix Civic Plaza / Munich University of Technology / Case Western Reserve University / Pennsylvania State University / U. S. Air Force Rome Air Development Center / Institute of Technology Tel / Doubletree Hotel / Purdue University / University of Michigan / University of California / Middle East Technical University / Carleton University / Technical University of Vienna / University Tel / Staffordshire University / Brigham Young University / State University of New York / University of Wisconsin Dr. James A. Dayton / National Institute of Microtechnologies / Rowan University / IBM Semiconductor Research and Development Center / The Ohio State University / University of Bern / Chemnitz University / IBM Watson Research Center / Motorola University / Columbia University / Hyatt Regency Phoenix Civic Plaza / University of California at Berkeley / Integrated Systems Laboratory / University of Wales / Xerox Palo Alto Research Center / University of Texas / Operations Center / University of Illinois at Chicago / Rensselaer Polytechnic Institute / Carnegie Mellon University / Delft University of Technology / L. Yu University of California / Southwest Texas State University / Institute of Electrical / University of Central Florida / Van Der Vort IEEE Operations Center / Carnegie-Mellon University / University of Milan / The University of Michigan / NASA Jet Propulsion Laboratory / Clemson University / Fudan University / Lawrence Berkeley Na-tional Laboratory / Addis Ababa University / Monterey Conference Center / Seoul National University / /

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IndustryTerm

manufacturing facility / quantum effect devices / travel subsidy / bipolar transistor technology / speed communication systems / micro-electromechanical systems / chemical mechanical planarization process development / millimeter wave devices / on-line access / pulsed power devices / burn-in/device / speed applications / wafer-level reliability assessment systems / functional/parametric test equipment / optical devices / compound semiconductor devices / conference web site / bipolar and passive devices / microelectronic devices / microwave passive devices / semiconductor device / mixed signal technology development / process technology / thin-body devices / electron devices / electronics / reliability simulation tools / base technology development / Wireless OEM Devices / hot carrier phenomena / power devices / frequency devices / technology development / imaging / photomask manufacturing / ion devices / semiconductor manufacturing / manufacturing / 300mm chip / technology developments / acoustic imaging / Wireless Communication / technology innovations / chemical engineering / microwave devices / appropriate solution / Under systems / test equipment / wave devices / electronic products / semiconductor chips / /

NaturalFeature

Silicon-Germanium Heterostructure Channel / Nisava valley / /

Organization

National Institute of Microtechnologies / University of Michigan / Ann Arbor / Seoul National University / University of California / Santa Barbara / Program Committee / Staffordshire University / Motorola University / Intel Foundation / Rensselaer Polytechnic Institute / General Chairman University / Rowan University / The Ohio State University / EDS Technical Committee on Vacuum Devices / Lawrence Berkeley Na-tional Laboratory / Institute of Electrical / Department of Microelectronics / Case Western Reserve University / Cleveland / Operations Center / IEEE Electron Devices Society / Purdue University / University of California at San Diego / State University of New York / the Pennsylvania State University / Brigham Young University / University of Illinois / Yugoslav Academy of Engineering / Fudan University / Shanghai / Santa Clara University / Chemnitz University / Society for ETRAN / Tau Beta Pi / Tokyo Institute of Technology / University of Texas at Dallas / Carleton University / University of Wisconsin / The University of Michigan / Columbia University / Group Business Unit / Serbian Ministry of Science / Technology and Development / University of Milan / UC Berkeley / University of Nis / Publications Chair Renuka P. Jindal University of Louisiana / U. S. Air Force Rome Air Development Center / DePauw University / Delft University of Technology / National Taiwan University / University of Bern / Faculty of Electronic Engineering / Addis Ababa University / Addis Ababa / EDS Office / Development Lab / University of Central Florida / Orlando / Carnegie-Mellon University / Carnegie Mellon University / Pittsburgh / Electron Devices Society / University of California / San Diego / Institute of Electrical and Electronics Engineers / Renuka P. Jindal University of Louisiana / Middle East Technical University / M.I.T / IEEE EDS / Munich University of Technology / City Assembly of Nis / University of Wales / ED/SSC Chapter / Stanford University / University of Vienna / Vanderbilt University / Southwest Texas State University / National Aeronautics and Space Administration / Engineering / and City Assembly of Nis / Clemson University / /

Person

Dan M. Goebel / Richard True / Vern Heinen / Grade / Seshadri Subbanna / Monica Blank / Baruch Levush / Robert A. Groves / Jeffrey Bokor / Paul Rappaport / Jakub Kedzierski / Tsu-Jae King / John Florkey / Yehuda Goren / James Dayton / Jr. / Kathryn Schonenberg / David C. Ahlgren / Jack Morton / Steven J. Hillenius / GEORGE E SMITH / Carol L. Kory / Frank Golan / Andreas D. Stricker / Vivek Subramanian / John H. Booske / George E. Smith / Greg Freeman / George Smith / Peiqi Xuan / Chenming Hu / Marwan H. Khater / Kenneth J. Stein / Bernie Pietrucha / Shwu-Jen Jeng / Jeffery Johnson / Ralph Nadell / Peter Smith / Yee Chia Yeo / William L. Menninger / François Pagette / David R. Greenberg / John K. Lowell / Alfred U. Mac Rae Mac / William F. Van Der Vort / Bruce F. Griffing / Y. Yang Santa / Hiroshi Iwai / James B. Kuo / Kenneth F. Galloway / /

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Position

Executive Director / Vice President / equipment engineer / Executive Office / Secretary / Test/Device engineer / author / Manager of SiGe Advanced BiCMOS Technology Development / process engineer / Technical Program Chair / Treasurer / Regions/Chapters Chair / Professor of Electrical Engineering / Recording Head Operations / Advisory Engineer in the Silicon Germanium BiCMOS Department / IRPS General Chair / Consultant / Engineering Manager / Editor-in-Chief / Program Chairperson Local Arrangements Education Awards Chair Publicity Finance Plenary Sessions Special Issue Editor Finance / Electron Devices Society President / CTO / same faculty advisor / President / Professor of Electrical Engineering and Computer Science / faculty advisor / Awards Chair / Staff Engineer / development engineer / senior engineering manager / managing a department / Executive / General Chair / program manager / semiconductor device researcher / Membership Chair / appropriate Editor / SiGe process integration engineer / p.yu@ieee.org Meetings Chair / Chair / photolithography engineer / c.claeys@ieee.org EDS Executive Director / King / member / /

ProgrammingLanguage

DC / /

ProvinceOrState

Ohio / Louisiana / Utah / South Carolina / California / Arizona / Ontario / Texas / New Jersey / Illinois / Minnesota / Hawaii / New York / Michigan / Vermont / Florida / /

PublishedMedium

the IEDM proceedings / /

Region

Southwest Texas / Middle East / southeastern Serbia / Central Florida / /

SportsLeague

Stanford University / /

TVStation

Kory / /

Technology

Component Technology / SRAM technology / Memory Technology / semiconductor / Microwave / NonVolatile Memory / laser / flash memory / dielectric / simulation / MEMS Technology / process technology / photolithography / integrated circuits / CMP / MEMS / semiconductor chips / CAD / semiconductor devices / lithography / 300mm chip / bipolar transistor technology / /

URL

http /

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