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![]() Date: 2004-01-06 12:28:16Skills Soldering Solder Interposer Manufacturing Electronics manufacturing Electronics Electromagnetism | Add to Reading List |
![]() | Electroless and electrolytic copper plating of glass interposer combined with metal oxide adhesion layer for manufacturing 3D RF devices Zhiming Liu, Hailuo Fu, Sara Hunegnaw, Jun Wang, Michael Merschky, Tafadzwa MagayaDocID: 1vqw7 - View Document |
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![]() | Paper Title 3D Si Interposer Design and Electrical Performance Study Authors Mandy (Ying) JiDocID: 1a9tX - View Document |
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