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Date: 2006-03-15 16:26:31 Technology Central processing unit Computer cooling Solid Flip chip Solder Integrated circuit Microelectromechanical systems Electronics Electromagnetism Electrical engineering Materials science		Microsoft Word - Nano2006CKW2.doc Add to Reading List Source URL: www.ee.washington.edu Download Document from Source Website File Size: 153,44 KB Share Document on Facebook

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