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Electromagnetism / Ball grid array / Flip chip / Surface-mount technology / Flexible circuit / Printed circuit board / Solder / Chip scale package / Integrated circuit / Electronics manufacturing / Electronics / Electronic engineering
Date: 2009-09-24 19:28:26
Electromagnetism
Ball grid array
Flip chip
Surface-mount technology
Flexible circuit
Printed circuit board
Solder
Chip scale package
Integrated circuit
Electronics manufacturing
Electronics
Electronic engineering

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