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Manufacturing / Reflow soldering / Surface-mount technology / Rework / Solder / Thermal profiling / Printed circuit board / Flip chip / Desoldering / Electronics manufacturing / Electronics / Electronic engineering


Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages
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Document Date: 2013-03-04 05:56:59


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File Size: 278,97 KB

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