Thermal Management at the Faceplate White Paper ABSTRACT: This whitepaper represents the work of the OIF to consider the system issues for thermal management at the faceplate of a line card. Issues associated with - Thermal management of electronic devices and systems - Document - PDFSEARCH.IO

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	Thermal Management at the Faceplate White Paper ABSTRACT: This whitepaper represents the work of the OIF to consider the system issues for thermal management at the faceplate of a line card. Issues associated with Add to Reading List Document Date: 2012-06-05 15:15:34 Open Document File Size: 1,45 MB Share Result on Facebook Company Working Group / EMC / Mentor Graphics / Google Thermal Group / / Currency CFP / / Facility ASIC complex / / IndustryTerm telecommunications applications / telecommunications environments / electronics / network processing elements / energy use / telecommunications equipment / interoperable networking solutions / optical networking products / telecommunications / improved thermal management / higher power density devices / / NaturalFeature Small Flow Channel / Inlet 40°C / 55°C inlet / 40°C inlet / / Organization ASIC / Open Area Total =3179mm2 Above Board / =3179mm2 Above Board / / Person Al Heatsink / / / Position Executive / / Technology Ethernet / component technologies / laser / heat transfer / ASIC / optical fibre / Fiber optic / optical networking / / SocialTag Chemical engineering Thermodynamics Passive fire protection Electronic engineering Thermal management of electronic devices and systems Thermal resistance Heat sink Heat pipe Heat exchanger Mechanical engineering

Thermal Management at the Faceplate White Paper ABSTRACT: This whitepaper represents the work of the OIF to consider the system issues for thermal management at the faceplate of a line card. Issues associated withAdd to Reading List